3D STEP MODEL - Footprints & 3D Models with Customizable Preferences

2 MILLION+ intelligent footprints & 3D models, easily customizable with your preferences - or simply use the IPC or manufacturer defaults. You have unprecedented control of your CAD library features with no limit on number of preference files!
Parts on POD must be used with the latest Footprint Expert.

Texas Instruments searched for Part Number: "3D STEP MODEL"


(295 Total Parts Found)   (Showing 291 - 295)   (Page 59 of 59)
     

       
Manufacturer:
Part Number:
Case Code:
Datasheet:
Footprint Name:
 Texas Instruments
3D STEP Model
YFD0006-C02
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BGA6CP40_3X2_76X117X40B23

customer login required - 1 credit

Status:  Obsolete
Updated:  7/24/2025 5:11:00 AM
Mounting Type:  Surface Mount
Logical Description:
    Use for 3D Model ONLY, not Footprint
Physical Description:
    Ball Grid Array (BGA), 0.40 mm pitch, rect.; 6 pin, 0.765 mm L X 1.17 mm W X 0.40 mm H body
Manufacturer:
Part Number:
Case Code:
Datasheet:
Footprint Name:
 Texas Instruments
3D STEP Model
YFF0006
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TI_YFF0006

customer login required - 1 credit

Status:  Obsolete
Updated:  7/24/2025 3:11:00 PM
Mounting Type:  Surface Mount
Logical Description:
    Use for 3D Model ONLY, not Footprint
Physical Description:
    Ball Grid Array (BGA), 0.40 mm pitch, rect.; 6 pin, 1.258 mm L X 0.856 mm W X 0.625 mm H body
Manufacturer:
Part Number:
Case Code:
Datasheet:
Footprint Name:
 Texas Instruments
3D STEP Model
YAH0006-C01
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BGA6CP50_2X3_132X82X40B22

customer login required - 1 credit

Status:  Obsolete
Updated:  7/24/2025 5:11:00 AM
Mounting Type:  Surface Mount
Logical Description:
    Use for 3D Model ONLY, not Footprint
Physical Description:
    Ball Grid Array (BGA), 0.50 mm pitch, rect.; 6 pin, 1.328 mm L X 0.828 mm W X 0.40 mm H body
Manufacturer:
Part Number:
Case Code:
Datasheet:
Footprint Name:
 Texas Instruments
3D STEP Model
YCG0025
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BGA25CP35_5X5_200X200X50B20

customer login required - 1 credit

Status:  Obsolete
Updated:  7/24/2025 5:11:00 AM
Mounting Type:  Surface Mount
Logical Description:
    Use for 3D Model ONLY, not Footprint
Physical Description:
    Ball Grid Array (BGA), 0.35 mm pitch, square; 25 pin, 2.00 mm L X 2.00 mm W X 0.50 mm H body
Manufacturer:
Part Number:
Case Code:
Datasheet:
Footprint Name:
 Texas Instruments
3D STEP Model
YBH0009-C02
Download PDF - login required
TI_YBH0009-C02

customer login required - 1 credit

Status:  Obsolete
Updated:  7/24/2025 5:11:00 AM
Mounting Type:  Surface Mount
Logical Description:
    Use for 3D Model ONLY, not Footprint
Physical Description:
    Ball Grid Array (BGA), 0.40 mm pitch, square; 9 pin, 1.607 mm L X 1.607 mm W X 0.40 mm H body

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(Showing 291 - 295 of 295)   (Page 59 of 59)