XCZU9EGFFVC900 - Footprints & 3D Models with Customizable Preferences

2 MILLION+ intelligent footprints & 3D models, easily customizable with your preferences - or simply use the IPC or manufacturer defaults. You have unprecedented control of your CAD library features with no limit on number of preference files!
Parts on POD must be used with the latest Footprint Expert.

Xilinx searched for Part Number: "XCZU9EGFFVC900"


(1 Total Part Found)  
     

       
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Footprint Name:
 Xilinx
XCZU9EGFFVC900
FFVC900
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BGA900CP100_30X30_3100X3100X342B60

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Status:  Active
Updated:  4/18/2023 3:15:00 PM
Mounting Type:  Surface Mount
Logical Description:
    IC, Zynq UltraScale+ MPSoC, Surface Mount
Physical Description:
    Ball Grid Array (BGA), 1.00 mm pitch, square; 900 pin, 31.00 mm L X 31.00 mm W X 3.42 mm H body