W25Q256JWYIM - Footprints & 3D Models with Customizable Preferences

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Winbond Electronics searched for Part Number: "W25Q256JWYIM"


(1 Total Part Found)  
     

       
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Part Number:
Case Code:
Datasheet:
Footprint Name:
 Winbond Electronics
W25Q256JWYIM
WLCSP-32
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BGA32NP50_8X6_476X382X54B30

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Status:  Active
Updated:  11/3/2021
Mounting Type:  Surface Mount
Logical Description:
    IC, Serial Flash Memory with Dual or Quad SPI and QPI, 256M Bit, 1.8V
Physical Description:
    Ball Grid Array (BGA), 0.50 mm pitch, rect.; 32 pin, 4.766 mm L X 3.826 mm W X 0.54 mm H body