WLP900T.5C-DC307D - Footprints & 3D Models with Customizable Preferences
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WLP900T.5C-DC307D
BGA900
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BGA900NP50_30X30_1500X1500X67B30
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Status:Active Updated: 5/11/2021 10:37:00 AM Mounting Type:Surface Mount Logical Description: IC, Ball Grid Array, 0.50 mm Pitch Physical Description: Ball Grid Array (BGA), 0.50 mm pitch, square; 900 pin, 15.00 mm L X 15.00 mm W X 0.67 mm H body