TPS62601YFFT - Footprints & 3D Models with Customizable Preferences

2 MILLION+ intelligent footprints & 3D models, easily customizable with your preferences - or simply use the IPC or manufacturer defaults. You have unprecedented control of your CAD library features with no limit on number of preference files!
Parts on POD must be used with the latest Footprint Expert.

Texas Instruments searched for Part Number: "TPS62601YFFT"


(3 Total Parts Found)  
     

       
Manufacturer:
Part Number:
Case Code:
Datasheet:
Footprint Name:
Texas Instruments
TPS62601YFFT
YZC R-XBGA-N6
Download PDF - login required
BGA6CP50_2X3_150X100X62B30

customer login required - 1 credit

Status:  Obsolete
Updated:  4/18/2023 3:15:00 PM
Mounting Type:  Surface Mount
Logical Description:
    IC, 500mA, 6 MHz Synchronous Step-Down Converter in Chip Scale Packaging
Physical Description:
    Ball Grid Array (BGA), 0.50 mm pitch, rect.; 6 pin, 1.50 mm L X 1.00 mm W X 0.625 mm H body
Manufacturer:
Part Number:
Case Code:
Datasheet:
Footprint Name:
Texas Instruments
TPS62601YFFT
YFF0006
Download PDF - login required
BGA6CP40_2X3_160X120X62B25

customer login required - 1 credit

Status:  Active
Updated:  6/27/2025 8:22:00 PM
Mounting Type:  Surface Mount
Logical Description:
    IC, 500-mA, 6-MHz Syncronous Step-Down Converter
Physical Description:
    Ball Grid Array (BGA), 0.40 mm pitch, rect.; 6 pin, 1.60 mm L X 1.20 mm W X 0.625 mm H body
Manufacturer:
Part Number:
Case Code:
Datasheet:
Footprint Name:
Texas Instruments
TPS62601YFFT.B
YFF0006
Download PDF - login required
BGA6CP40_2X3_160X120X62B25

customer login required - 1 credit

Status:  Active
Updated:  6/27/2025 8:22:00 PM
Mounting Type:  Surface Mount
Logical Description:
    IC, 500-mA, 6-MHz Syncronous Step-Down Converter
Physical Description:
    Ball Grid Array (BGA), 0.40 mm pitch, rect.; 6 pin, 1.60 mm L X 1.20 mm W X 0.625 mm H body