XPC8260CVVIFBC - Footprints & 3D Models with Customizable Preferences

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NXP Semiconductors searched for Part Number: "XPC8260CVVIFBC"


(1 Total Part Found)  
     

       
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Footprint Name:
 NXP Semiconductors
XPC8260CVVIFBC
SOT1752-1
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BGA480CP127_29X29_3750X3750X170B75

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Status:  Active
Updated:  4/18/2023 3:15:00 PM
Mounting Type:  Surface Mount
Logical Description:
    IC, QUICC Integrated Communications Processor, 200 MHz
Physical Description:
    Ball Grid Array (BGA), 1.27 mm pitch, square; 480 pin, 37.50 mm L X 37.50 mm W X 1.70 mm H body