MSCMMX6QZDK08AB - Footprints & 3D Models with Customizable Preferences

2 MILLION+ intelligent footprints & 3D models, easily customizable with your preferences - or simply use the IPC or manufacturer defaults. You have unprecedented control of your CAD library features with no limit on number of preference files!
Parts on POD must be used with the latest Footprint Expert.

NXP Semiconductors searched for Part Number: "MSCMMX6QZDK08AB"


(1 Total Part Found)  
     

       
Manufacturer:
Part Number:
Case Code:
Datasheet:
Footprint Name:
 NXP Semiconductors
MSCMMX6QZDK08AB
SCM BGA POP
Download PDF - login required
NXP_SCM_BGA_POP

customer login required - 2 credits

Status:  Obsolete
Updated:  4/18/2023 3:15:00 PM
Mounting Type:  
Logical Description:
    IC, ARM Microcontrollers - MCU RCP SCM-i.MX 6Q
Physical Description:
    Ball Grid Array (BGA), 0.65 mm pitch, rect.; 500 pin, 17.20 mm L X 14.20 mm W X 1.80 mm H body