MPC745BPX350LE - Footprints & 3D Models with Customizable Preferences

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NXP Semiconductors searched for Part Number: "MPC745BPX350LE"


(1 Total Part Found)  
     

       
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Footprint Name:
 NXP Semiconductors
MPC745BPX350LE
SOT1637-1
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BGA255CP127_16X16_2100X2100X280B75

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Status:  Active
Updated:  4/18/2023 3:15:00 PM
Mounting Type:  Surface Mount
Logical Description:
    IC, RISC Microprocessor, 350 MHz
Physical Description:
    Ball Grid Array (BGA), 1.27 mm pitch, square; 255 pin, 21.00 mm L X 21.00 mm W X 2.80 mm H body