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Wirebound inductor |
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dramos 
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Joined: 18 Feb 2021 Status: Offline Points: 61 |
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 Topic: Wirebound inductorPosted: 03 Mar 2021 at 5:55am |
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Hi to all:
I am trying to create a footprint of a wirebound inductor, Murata LQW18AN5N6G80D. I configured my component as an SMD/Chip/Inductor and as the metalization of the pin part is not the height of the component, I configured the height of the part as the height of the metalization.  How do you resolve that kind of components? Thanks for your comments. dramos |
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Tom H
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Joined: 05 Jan 2012 Location: San Diego, CA Status: Offline Points: 5716 |
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Posted: 03 Mar 2021 at 9:53am |
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These Inductors are becoming more popular these days. There should be a mfr. recommended pattern for the footprint. If not, the pad size is:
Heel = 0.00 but you need to compensate for the +/- body length tolerance of 0.10 Side = 50% of the metal thickness height up the side (Maximum) Toe = 100% of the metal thickness height up the side (Maximum) So the pad size for this part is 0.56 L X 1.20 W. Add 0.05 for the Heel to compensate for the tolerance. Here's a SolidWorks 3D model:  |
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dramos
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Posted: 04 Mar 2021 at 12:17am |
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Hi Tom:
Yes you are right . We are using more and more this kind of components in our designs. Many thanks for your recommendations. Regards. David
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IMI4tth3w
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Joined: 04 Mar 2021 Status: Offline Points: 1 |
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Posted: 04 Mar 2021 at 8:53am |
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I actually just did a footprint for one of these types of inductors.
Coilcraft seems to have pretty good guidelines for footprints in their datasheets. Here's an example: https://www.coilcraft.com/en-us/products/rf/ferrite-core-chip-inductors/0603-(1608)/0603ls/ |
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Tom H
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Joined: 05 Jan 2012 Location: San Diego, CA Status: Offline Points: 5716 |
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Posted: 04 Mar 2021 at 9:06am |
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Continue to use the mfr. recommended pattern for this new package style and new terminal lead form.
Automating a software program to calculate the pad stack would need to identify a new terminal lead form and then the solder joint goal table for a 3-Tier density level. It's too late to put it in IPC-7351C and it's not in IPC-J-STD-001 yet for assembly solder joint acceptability. |
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Jeromeli
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Joined: 10 Jun 2021 Status: Offline Points: 12 |
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Posted: 01 Apr 2022 at 5:55am |
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I have encountered a similar problem recently, and I am trying to solve it
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Tom H
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Posted: 01 Apr 2022 at 10:46am |
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You must use the Manufacturer's Recommended Pattern.
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