PCB Libraries Forum : Wirebound inductor https://www.PCBLibraries.com/forum/ Sun, 05 Apr 2026 13:19:40 +0000 Mon, 30 Jun 2025 07:36:40 +0000 http://blogs.law.harvard.edu/tech/rss Web Wiz Forums 12.07 360 https://www.PCBLibraries.com/forum/RSS_post_feed.asp?TID=2837 <![CDATA[PCB Libraries Forum]]> https://www.PCBLibraries.com/forum/forum_images/PCBLForumLogo.gif https://www.PCBLibraries.com/forum/ <![CDATA[Wirebound inductor : This MurataLQH44PN150MPRL have...]]> https://www.PCBLibraries.com/forum/wirebound-inductor_topic2837_post13904.html#13904 Author: Tom H
Subject: 2837
Posted: 30 Jun 2025 at 7:36am

This Murata LQH44PN150MPRL have a trapezoid pad shape. 

It cannot be created in Footprint Expert, but we can build it in a CAD tool and export/import the ASCII file into FPX format. 


  
]]> Mon, 30 Jun 2025 07:36:40 +0000 https://www.PCBLibraries.com/forum/wirebound-inductor_topic2837_post13904.html#13904 <![CDATA[Wirebound inductor : Hi all,I&#039;m trying to create...]]> https://www.PCBLibraries.com/forum/wirebound-inductor_topic2837_post13903.html#13903 Author: pem3bg
Subject: 2837
Posted: 30 Jun 2025 at 6:36am

Hi all,
I'm trying to create footprint for an inductor like on the next picture:
What would be the best type to use for this inductor (Chip Inductor or DFN 2 pins  Inductor).
I'm asking this because I want to have IPC name for this footprint and when I create footprint with both types I got different name. So what would be the best solution for this.
It's Murata LQH44PN150MPRL
]]> Mon, 30 Jun 2025 06:36:14 +0000 https://www.PCBLibraries.com/forum/wirebound-inductor_topic2837_post13903.html#13903 <![CDATA[Wirebound inductor : You must use the Manufacturer&#039;s...]]> https://www.PCBLibraries.com/forum/wirebound-inductor_topic2837_post12337.html#12337 Author: Tom H
Subject: 2837
Posted: 01 Apr 2022 at 10:46am

You must use the Manufacturer's Recommended Pattern. 

]]> Fri, 01 Apr 2022 10:46:55 +0000 https://www.PCBLibraries.com/forum/wirebound-inductor_topic2837_post12337.html#12337 <![CDATA[Wirebound inductor : I have encountered a similar problem...]]> https://www.PCBLibraries.com/forum/wirebound-inductor_topic2837_post12336.html#12336 Author: Jeromeli
Subject: 2837
Posted: 01 Apr 2022 at 5:55am

I have encountered a similar problem recently, and I am trying to solve it]]> Fri, 01 Apr 2022 05:55:31 +0000 https://www.PCBLibraries.com/forum/wirebound-inductor_topic2837_post12336.html#12336 <![CDATA[Wirebound inductor : Continue to use the mfr. recommended...]]> https://www.PCBLibraries.com/forum/wirebound-inductor_topic2837_post11265.html#11265 Author: Tom H
Subject: 2837
Posted: 04 Mar 2021 at 9:06am

Continue to use the mfr. recommended pattern for this new package style and new terminal lead form. 

Automating a software program to calculate the pad stack would need to identify a new terminal lead form and then the solder joint goal table for a 3-Tier density level. 

It's too late to put it in IPC-7351C and it's not in IPC-J-STD-001 yet for assembly solder joint acceptability. 

]]> Thu, 04 Mar 2021 09:06:10 +0000 https://www.PCBLibraries.com/forum/wirebound-inductor_topic2837_post11265.html#11265 <![CDATA[Wirebound inductor : I actually just did a footprint...]]> https://www.PCBLibraries.com/forum/wirebound-inductor_topic2837_post11264.html#11264 Author: IMI4tth3w
Subject: 2837
Posted: 04 Mar 2021 at 8:53am

I actually just did a footprint for one of these types of inductors.

Coilcraft seems to have pretty good guidelines for footprints in their datasheets.

Here's an example:
https://www.coilcraft.com/en-us/products/rf/ferrite-core-chip-inductors/0603-(1608)/0603ls/
https://www.coilcraft.com/getmedia/50061a32-b9f8-4dc5-bb10-57c731e20d9c/0603ls.pdf


]]> Thu, 04 Mar 2021 08:53:51 +0000 https://www.PCBLibraries.com/forum/wirebound-inductor_topic2837_post11264.html#11264 <![CDATA[Wirebound inductor : Hi Tom:Yes you are right . We...]]> https://www.PCBLibraries.com/forum/wirebound-inductor_topic2837_post11263.html#11263 Author: dramos
Subject: 2837
Posted: 04 Mar 2021 at 12:17am

Hi Tom:

Yes you are right . We are using more and more this kind of components in our designs.

Many thanks for your recommendations.

Regards.
David
]]> Thu, 04 Mar 2021 00:17:40 +0000 https://www.PCBLibraries.com/forum/wirebound-inductor_topic2837_post11263.html#11263 <![CDATA[Wirebound inductor : These Inductors are becoming more...]]> https://www.PCBLibraries.com/forum/wirebound-inductor_topic2837_post11259.html#11259 Author: Tom H
Subject: 2837
Posted: 03 Mar 2021 at 9:53am

These Inductors are becoming more popular these days. There should be a mfr. recommended pattern for the footprint. If not, the pad size is: 

Heel = 0.00 but you need to compensate for the +/- body length tolerance of 0.10
Side = 50% of the metal thickness height up the side (Maximum)
Toe = 100% of the metal thickness height up the side (Maximum) 

So the pad size for this part is 0.56 L X 1.20 W. Add 0.05 for the Heel to compensate for the tolerance. 

Here's a SolidWorks 3D model: 




]]> Wed, 03 Mar 2021 09:53:46 +0000 https://www.PCBLibraries.com/forum/wirebound-inductor_topic2837_post11259.html#11259 <![CDATA[Wirebound inductor : Hi to all:I am trying to create...]]> https://www.PCBLibraries.com/forum/wirebound-inductor_topic2837_post11258.html#11258 Author: dramos
Subject: 2837
Posted: 03 Mar 2021 at 5:55am

Hi to all:

I am trying to create a footprint of a wirebound inductor, Murata LQW18AN5N6G80D.

I configured my component as an SMD/Chip/Inductor and as the metalization of the pin part is not the height of the component, I configured the height of the part as the height of the metalization.



How do you resolve that kind of components?

Thanks for your comments.
dramos


]]> Wed, 03 Mar 2021 05:55:17 +0000 https://www.PCBLibraries.com/forum/wirebound-inductor_topic2837_post11258.html#11258