Footprint Expert 24.01 Released!!

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   Version 24.01 was just released!!
Fixes & Enhancements:
Options:
Recommended for existing users – Create a new Option file from scratch. Do not use your existing .opt file.
Updated the Internal Defaults to IPC-7352 Guideline
Removed Fab & Assy tolerances and changed all negative solder joint goals to 0.00
Note 1: this update might create SMD pad sizes smaller by an average of – 0.01 to 0.03 mm
Note 2: there will be a V23.opt file for users who want the original (IPC-7351) version
But you can still use your original .opt file if you don’t want to update to IPC-7352
Note 3: if you want to use the new IPC-7352 options to upgrade to the new mathematical model for pad stack calculations, you should recreate your Master Option file from scratch by selecting “File > New (Internal Defaults)” then “File > Save As > New Name.opt”
Note 4: V24 installs into a separate folder to allow you to run V23 and V24 side by side to copy your existing Options to a new Option file
Redesigned all the Terminal Options GUI
Major rewrite for all Grid Array component families – BGA, CGA and LGA
Added the ability to enter 1 for pad size and placement
3 = 0.001
2 = 0.01
1 = 0.10
CAD Tools:
Allegro – translator dug in pad stack definition for mask layers
FP Designer: 
Moving a calculator footprint to FP Designer and selecting “New” pad stack created an error message
Calculators:
Batch Build was only creating one footprint
BGA pad trimming caused a discrepancy between the actual pad size and the displayed pad size
Through-hole pad stack calculations were updated

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Nick B Members Profile Send Private Message Find Members Posts Add to Buddy List Admin Group Joined: 02 Jan 2012 Status: Offline Points: 1908	Post Options Post Reply Quote Nick B Report Post Thanks(0) Quote Reply Topic: Footprint Expert 24.01 Released!! Posted: 13 Dec 2023 at 10:49am
	Version 24.01 was just released!! Fixes & Enhancements: Options: Recommended for existing users – Create a new Option file from scratch. Do not use your existing .opt file. Updated the Internal Defaults to IPC-7352 Guideline Removed Fab & Assy tolerances and changed all negative solder joint goals to 0.00 Note 1: this update might create SMD pad sizes smaller by an average of – 0.01 to 0.03 mm Note 2: there will be a V23.opt file for users who want the original (IPC-7351) version But you can still use your original .opt file if you don’t want to update to IPC-7352 Note 3: if you want to use the new IPC-7352 options to upgrade to the new mathematical model for pad stack calculations, you should recreate your Master Option file from scratch by selecting “File > New (Internal Defaults)” then “File > Save As > New Name.opt” Note 4: V24 installs into a separate folder to allow you to run V23 and V24 side by side to copy your existing Options to a new Option file Redesigned all the Terminal Options GUI Major rewrite for all Grid Array component families – BGA, CGA and LGA Added the ability to enter 1 for pad size and placement 3 = 0.001 2 = 0.01 1 = 0.10 CAD Tools: Allegro – translator dug in pad stack definition for mask layers FP Designer: Moving a calculator footprint to FP Designer and selecting “New” pad stack created an error message Calculators: Batch Build was only creating one footprint BGA pad trimming caused a discrepancy between the actual pad size and the displayed pad size Through-hole pad stack calculations were updated
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