http://www.pcblibraries.com/downloads" rel="nofollow -  Fixes & Enhancements: - Options:
- Recommended for existing users – Create a new Option file from scratch. Do not use your existing .opt file.
- Updated the Internal Defaults to IPC-7352 Guideline
- Removed Fab & Assy tolerances and changed all negative solder joint goals to 0.00
- Note 1: this update might create SMD pad sizes smaller by an average of – 0.01 to 0.03 mm
- Note 2: there will be a V23.opt file for users who want the original (IPC-7351) version
- But you can still use your original .opt file if you don’t want to update to IPC-7352
- Note 3: if you want to use the new IPC-7352 options to upgrade to the new mathematical model for pad stack calculations, you should recreate your Master Option file from scratch by selecting “File > New (Internal Defaults)” then “File > Save As > New Name.opt”
- Note 4: V24 installs into a separate folder to allow you to run V23 and V24 side by side to copy your existing Options to a new Option file
- Redesigned all the Terminal Options GUI
- Major rewrite for all Grid Array component families – BGA, CGA and LGA
- Added the ability to enter 1 for pad size and placement
- 3 = 0.001
- 2 = 0.01
- 1 = 0.10
- CAD Tools:
- Allegro – translator dug in pad stack definition for mask layers
- FP Designer:
- Moving a calculator footprint to FP Designer and selecting “New” pad stack created an error message
- Calculators:
- Batch Build was only creating one footprint
- BGA pad trimming caused a discrepancy between the actual pad size and the displayed pad size
- Through-hole pad stack calculations were updated
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