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Standard Chip Package Case Codes & Dimensions |
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Tom H 
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Joined: 05 Jan 2012 Location: San Diego, CA Status: Offline Points: 5719 |
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 Posted: 08 Sep 2021 at 8:32am |
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Read the User Guide in the main installation folder under "Documents".
Select File > Save As > Your Master Options .opt |
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AnonAnon
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Joined: 07 Feb 2022 Status: Offline Points: 1 |
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Posted: 07 Feb 2022 at 5:41am |
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Hi Tom, Please excuse me if you've answered this a thousand times but I'm looking to find which standard defined the "Least" and "Most" limits for each footprint. I can see IPC-SM-782 defines the nominal and references equations in a section 3.3? I am happy to purchase the standard but wanted to ensure it contained the correct information before I purchase. Do the IPC standards only provide the nominal and one has to calculate the limits? Kind regards, David
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Tom H
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Joined: 05 Jan 2012 Location: San Diego, CA Status: Offline Points: 5719 |
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Posted: 07 Feb 2022 at 10:01am |
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IPC-7351B contains the 3-Tier Density Levels for Land Patterns.
However, that document is 12 years old and out of date and it took information from the 1987 IPC-SM-782 which is obsolete. The solder Joint values are way too robust for today's technology. Footprint Expert solder joint goals are derived from IPC J-STD-001 standard as it's the main standard that all other standards are built upon. |
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