Footprint Expert 25.03 Released!!

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   Version 25.03 was just released!!
Fixes & Enhancements:
3D STEP Models:
LGA - Drafting option terminal outlines are turned off to CAD tool, it also removes the terminal leads
CAD Tool Interfaces:
Altium: Code added to Altium translator to display all layers applied by a .pas script
Xpedition:
Drafting shapes not translating to Solder Mask and Paste Mask layers
ASCII file extension changed from .asc to .hkp
Calculators:
SOFL 3 pin version - pads are getting trimmed for side-to-side clearance
Layer Display Controls - layer color changes are not taking place for silkscreen and assembly labels or pin numbers
Drafting Outlines:
60-degree triangle shape was auto-filling without selecting the fill checkbox
Symbol minimum line width reduced from 0.15 to 0.05 mm
Options:
IPC-7351B.opt - Updated a typo in the Gullwing > SOP > Most > Pitch >=0.50, <0.625 from 0.05 to 0.01
Drafting > Origin - unchecking "Add to Footprint" was not saving the updated settings
Drafting > Origin - Target diameter not conforming to user setting
SMD Pad Stack Rules - Updated Gang Mask feature for minimum solder mask web
FP Designer:
Updated the CSV file export to from Comma to Tab Delineated 
Courtyard still observes Pad and Body clearance even when their Courtyard 'Apply Excess...' Options checkbox is unchecked

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Nick B Members Profile Send Private Message Find Members Posts Add to Buddy List Admin Group Joined: 02 Jan 2012 Status: Offline Points: 1935	Post Options Post Reply Quote Nick B Report Post Thanks(0) Quote Reply Topic: Footprint Expert 25.03 Released!! Posted: 7 hours 10 minutes ago at 8:04pm
	Version 25.03 was just released!! Fixes & Enhancements: 3D STEP Models: LGA - Drafting option terminal outlines are turned off to CAD tool, it also removes the terminal leads CAD Tool Interfaces: Altium: Code added to Altium translator to display all layers applied by a .pas script Xpedition: Drafting shapes not translating to Solder Mask and Paste Mask layers ASCII file extension changed from .asc to .hkp Calculators: SOFL 3 pin version - pads are getting trimmed for side-to-side clearance Layer Display Controls - layer color changes are not taking place for silkscreen and assembly labels or pin numbers Drafting Outlines: 60-degree triangle shape was auto-filling without selecting the fill checkbox Symbol minimum line width reduced from 0.15 to 0.05 mm Options: IPC-7351B.opt - Updated a typo in the Gullwing > SOP > Most > Pitch >=0.50, <0.625 from 0.05 to 0.01 Drafting > Origin - unchecking "Add to Footprint" was not saving the updated settings Drafting > Origin - Target diameter not conforming to user setting SMD Pad Stack Rules - Updated Gang Mask feature for minimum solder mask web FP Designer: Updated the CSV file export to from Comma to Tab Delineated Courtyard still observes Pad and Body clearance even when their Courtyard 'Apply Excess...' Options checkbox is unchecked
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