http://www.pcblibraries.com/downloads" rel="nofollow -  Fixes & Enhancements: - 3D STEP Models:
- LGA - Drafting option terminal outlines are turned off to CAD tool, it also removes the terminal leads
- CAD Tool Interfaces:
- Altium: Code added to Altium translator to display all layers applied by a .pas script
- Xpedition:
- Drafting shapes not translating to Solder Mask and Paste Mask layers
- ASCII file extension changed from .asc to .hkp
- Calculators:
- SOFL 3 pin version - pads are getting trimmed for side-to-side clearance
- Layer Display Controls - layer color changes are not taking place for silkscreen and assembly labels or pin numbers
- Drafting Outlines:
- 60-degree triangle shape was auto-filling without selecting the fill checkbox
- Symbol minimum line width reduced from 0.15 to 0.05 mm
- Options:
- IPC-7351B.opt - Updated a typo in the Gullwing > SOP > Most > Pitch >=0.50, <0.625 from 0.05 to 0.01
- Drafting > Origin - unchecking "Add to Footprint" was not saving the updated settings
- Drafting > Origin - Target diameter not conforming to user setting
- SMD Pad Stack Rules - Updated Gang Mask feature for minimum solder mask web
- FP Designer:
- Updated the CSV file export to from Comma to Tab Delineated
- Courtyard still observes Pad and Body clearance even when their Courtyard 'Apply Excess...' Options checkbox is unchecked
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