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Footprint Expert 23.07 Released!!

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Nick B View Drop Down
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Joined: 02 Jan 2012
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    Posted: 02 May 2023 at 7:58am
Version 23.07 was just released!!

Fixes & Enhancements:
  • Options:
    • Updated the IPC-7352.opt file – The default Thermal Tab Paste Mask Reduction was changed from 50% to 60%
  • New Library Files:
    • Added 5 FPX files to the Library folder that contain over 18,600 component mfr. Case Codes:
    • BGA, SM Discrete, TH Discrete, Semiconductors, Connectors
  • Calculators:
    • Updated – Enlarged the graphic dimensional images so that the image fits in the box 
    • DPAK – L1 dimension can now be a negative value and it autogenerates a Thermal Pad
    • QFN – Assembly Outline was not mapping to the Nominal dimension when set “Map to Nominal” in Options 
    • LCC – Changing a package dimension threw an unhandled exception error
    • Flange Mount (Horizontal) – the silkscreen to Flat Lug Lead clearance was not following Option settings
  • Library Editor:
    • When selecting a single footprint row, selecting the Batch Build option added a duplicate Density Level suffix 
  • FP Designer:
    • Silkscreen to Pad Clearance Option was not being applied to through-hole pads
    • Editing package dimensions was not updating the Physical Description 
    • The 3D model was not generating a Polarity Dot
  • CAD Tool Interfaces:
    • KiCad – translator didn’t produce rounded-corner shapes for surface mount Square pad


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