http://www.pcblibraries.com/downloads" rel="nofollow -  Fixes & Enhancements: - Options:
- Updated the IPC-7352.opt file – The default Thermal Tab Paste Mask Reduction was changed from 50% to 60%
- New Library Files:
- Added 5 FPX files to the Library folder that contain over 18,600 component mfr. Case Codes:
- BGA, SM Discrete, TH Discrete, Semiconductors, Connectors
- Calculators:
- Updated – Enlarged the graphic dimensional images so that the image fits in the box
- DPAK – L1 dimension can now be a negative value and it autogenerates a Thermal Pad
- QFN – Assembly Outline was not mapping to the Nominal dimension when set “Map to Nominal” in Options
- LCC – Changing a package dimension threw an unhandled exception error
- Flange Mount (Horizontal) – the silkscreen to Flat Lug Lead clearance was not following Option settings
- Library Editor:
- When selecting a single footprint row, selecting the Batch Build option added a duplicate Density Level suffix
- FP Designer:
- Silkscreen to Pad Clearance Option was not being applied to through-hole pads
- Editing package dimensions was not updating the Physical Description
- The 3D model was not generating a Polarity Dot
- CAD Tool Interfaces:
- KiCad – translator didn’t produce rounded-corner shapes for surface mount Square pad
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