Footprint Expert 2021.02 Released!!

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Version 2021.02 was just released!!
NEW or Enhanced Features:
New Options > Drafting > Courtyard feature to Exclude Body and Pad Excess and ignore pads.
Drafting Shapes – Changed the default orientation for the Diode symbol to Cathode on the Left.
Updated the IPC-7351C Option file. Removed all negative solder joint goals and manufacturing tolerances.
Aluminum Capacitor component family – Footprint Name updated. The Lead Span was removed from old 2018 CAPAE name.
Capacitor Polarized, Axial Lead component family – Footprint Name updated. The V2018 axial body physical dimension wrong.
Fuse, Radial Lead component family – Footprint Name updated. The old name the letter O added to denote offset leads on radial parts.
LED, Radial Disk component family – Footprint Name updated. The old name was using the terminal thickness instead of the width.

Updates & Bugs Fixed:Options > Pad Stack Rules > Diode Pin Names – fixed an issue for Numeric pin names.
Fixed an FP Designer Courtyard issue when translating older FPX files to V2021 format.
Fixed an FP Designer issue for Round footprints the diameter was coming in at 0.00 when translating old FPX files to V2021 format.
Drafting Symbols – when changing the line width value, then selecting “Apply or Done” the original 0.12 value came back.
Courtyard Excess – when changing the courtyard excess to 0.00 the courtyard hugs the pads and body, except Chip Components.Axial Lead component family – Correction made to Footprint Name.
BGA component family – Correction made to Footprint Name. V2021 was not pulling the body style from the FPX file plus 2021 BGA pins in D & E axis were swapped.
Molded Body component family – Correction made to Footprint Name. V2021 footprint name was missing optional L1 dimension.
Header, Right Angle component family – Correction made to Footprint Name. V2021 right-angle-header height was missing.
Header, Vertical component family – Correction made to Footprint Name.  R and S added to name prefix to denote receptacle or shrouded; height missing in vertical configuration; H replaced X before height.
2-pin Side Concave component family – Correction made to Footprint Name. V2021 doesn’t need pin count for 2 pin parts;  pitch removed as a factor in the side-concave name.
QFN Component Family – Correction made to Footprint Name.  Thermal Tab missing from pin quantity in parts with removed or hidden pins.
TO, Flange Mount component family – Correction made to Footprint Name. Replaced H with X before height.
SOIC component family – Correction made to Footprint Name, Physical Description and 3D STEP model.
Footprint Warning text redundancy fixed.

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Nick B Members Profile Send Private Message Find Members Posts Add to Buddy List Admin Group Joined: 02 Jan 2012 Status: Offline Points: 1904	Post Options Post Reply Quote Nick B Report Post Thanks(0) Quote Reply Topic: Footprint Expert 2021.02 Released!! Posted: 15 Apr 2021 at 8:25am
	Version 2021.02 was just released!! NEW or Enhanced Features: New Options > Drafting > Courtyard feature to Exclude Body and Pad Excess and ignore pads. Drafting Shapes – Changed the default orientation for the Diode symbol to Cathode on the Left. Updated the IPC-7351C Option file. Removed all negative solder joint goals and manufacturing tolerances. Aluminum Capacitor component family – Footprint Name updated. The Lead Span was removed from old 2018 CAPAE name. Capacitor Polarized, Axial Lead component family – Footprint Name updated. The V2018 axial body physical dimension wrong. Fuse, Radial Lead component family – Footprint Name updated. The old name the letter O added to denote offset leads on radial parts. LED, Radial Disk component family – Footprint Name updated. The old name was using the terminal thickness instead of the width. Updates & Bugs Fixed: Options > Pad Stack Rules > Diode Pin Names – fixed an issue for Numeric pin names. Fixed an FP Designer Courtyard issue when translating older FPX files to V2021 format. Fixed an FP Designer issue for Round footprints the diameter was coming in at 0.00 when translating old FPX files to V2021 format. Drafting Symbols – when changing the line width value, then selecting “Apply or Done” the original 0.12 value came back. Courtyard Excess – when changing the courtyard excess to 0.00 the courtyard hugs the pads and body, except Chip Components.Axial Lead component family – Correction made to Footprint Name. BGA component family – Correction made to Footprint Name. V2021 was not pulling the body style from the FPX file plus 2021 BGA pins in D & E axis were swapped. Molded Body component family – Correction made to Footprint Name. V2021 footprint name was missing optional L1 dimension. Header, Right Angle component family – Correction made to Footprint Name. V2021 right-angle-header height was missing. Header, Vertical component family – Correction made to Footprint Name. R and S added to name prefix to denote receptacle or shrouded; height missing in vertical configuration; H replaced X before height. 2-pin Side Concave component family – Correction made to Footprint Name. V2021 doesn’t need pin count for 2 pin parts; pitch removed as a factor in the side-concave name. QFN Component Family – Correction made to Footprint Name. Thermal Tab missing from pin quantity in parts with removed or hidden pins. TO, Flange Mount component family – Correction made to Footprint Name. Replaced H with X before height. SOIC component family – Correction made to Footprint Name, Physical Description and 3D STEP model. Footprint Warning text redundancy fixed.
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