Version 2021.02 was just released!!

• Options > Pad Stack Rules > Diode Pin Names – fixed an issue for Numeric pin names.
• Fixed an FP Designer Courtyard issue when translating older FPX files to V2021 format.
• Fixed an FP Designer issue for Round footprints the diameter was coming in at 0.00 when translating old FPX files to V2021 format.
• Drafting Symbols – when changing the line width value, then selecting “Apply or Done” the original 0.12 value came back.
• Courtyard Excess – when changing the courtyard excess to 0.00 the courtyard hugs the pads and body, except Chip Components.Axial Lead component family – Correction made to Footprint Name.
• BGA component family – Correction made to Footprint Name. V2021 was not pulling the body style from the FPX file plus 2021 BGA pins in D & E axis were swapped.
• Molded Body component family – Correction made to Footprint Name. V2021 footprint name was missing optional L1 dimension.
• Header, Right Angle component family – Correction made to Footprint Name. V2021 right-angle-header height was missing.
• Header, Vertical component family – Correction made to Footprint Name.  R and S added to name prefix to denote receptacle or shrouded; height missing in vertical configuration; H replaced X before height.
• 2-pin Side Concave component family – Correction made to Footprint Name. V2021 doesn’t need pin count for 2 pin parts;  pitch removed as a factor in the side-concave name.
• QFN Component Family – Correction made to Footprint Name.  Thermal Tab missing from pin quantity in parts with removed or hidden pins.
• TO, Flange Mount component family – Correction made to Footprint Name. Replaced H with X before height.
• SOIC component family – Correction made to Footprint Name, Physical Description and 3D STEP model.
• Footprint Warning text redundancy fixed.