Footprint Expert 23.07 Released!!

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   Version 23.07 was just released!!
Fixes & Enhancements:
Options:
Updated the IPC-7352.opt file – The default Thermal Tab Paste Mask Reduction was changed from 50% to 60%
New Library Files:
Added 5 FPX files to the Library folder that contain over 18,600 component mfr. Case Codes:
BGA, SM Discrete, TH Discrete, Semiconductors, Connectors
Calculators:
Updated – Enlarged the graphic dimensional images so that the image fits in the box 
DPAK – L1 dimension can now be a negative value and it autogenerates a Thermal Pad
QFN – Assembly Outline was not mapping to the Nominal dimension when set “Map to Nominal” in Options 
LCC – Changing a package dimension threw an unhandled exception error
Flange Mount (Horizontal) – the silkscreen to Flat Lug Lead clearance was not following Option settings
Library Editor:
When selecting a single footprint row, selecting the Batch Build option added a duplicate Density Level suffix 
FP Designer:
Silkscreen to Pad Clearance Option was not being applied to through-hole pads
Editing package dimensions was not updating the Physical Description 
The 3D model was not generating a Polarity Dot
CAD Tool Interfaces:
KiCad – translator didn’t produce rounded-corner shapes for surface mount Square pad

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Nick B Members Profile Send Private Message Find Members Posts Add to Buddy List Admin Group Joined: 02 Jan 2012 Status: Offline Points: 1904	Post Options Post Reply Quote Nick B Report Post Thanks(0) Quote Reply Topic: Footprint Expert 23.07 Released!! Posted: 02 May 2023 at 7:58am
	Version 23.07 was just released!! Fixes & Enhancements: Options: Updated the IPC-7352.opt file – The default Thermal Tab Paste Mask Reduction was changed from 50% to 60% New Library Files: Added 5 FPX files to the Library folder that contain over 18,600 component mfr. Case Codes: BGA, SM Discrete, TH Discrete, Semiconductors, Connectors Calculators: Updated – Enlarged the graphic dimensional images so that the image fits in the box DPAK – L1 dimension can now be a negative value and it autogenerates a Thermal Pad QFN – Assembly Outline was not mapping to the Nominal dimension when set “Map to Nominal” in Options LCC – Changing a package dimension threw an unhandled exception error Flange Mount (Horizontal) – the silkscreen to Flat Lug Lead clearance was not following Option settings Library Editor: When selecting a single footprint row, selecting the Batch Build option added a duplicate Density Level suffix FP Designer: Silkscreen to Pad Clearance Option was not being applied to through-hole pads Editing package dimensions was not updating the Physical Description The 3D model was not generating a Polarity Dot CAD Tool Interfaces: KiCad – translator didn’t produce rounded-corner shapes for surface mount Square pad
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