Cylindrical End Cap Devices - Toe/Heel/Side Goals

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   We granted your wish and turned MELF solder joint goals into incremental pad stacks per the Nominal Diameter in V24.02 pre-release dated today 12/22/2023. New Nominal Diameter Ranges – 


 Dia. < 1.00 
 Dia. >= 1.00, <
     2.00
 Dia. >= 2.00, <
     3.00
 Dia. >= 3.00, <
     4.00
 Dia. > 4.00
Now you can control the Toe, Heel and Side for MELF Resistors, Diodes and Fuses. 

Thank you for recommending this feature. 

V24.02 will be officially released next week - www.pcblibraries.com/downloads

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Tom H Members Profile Send Private Message Find Members Posts Add to Buddy List Admin Group Joined: 05 Jan 2012 Location: San Diego, CA Status: Offline Points: 6032	Post Options Post Reply Quote Tom H Report Post Thanks(0) Quote Reply Topic: Cylindrical End Cap Devices - Toe/Heel/Side Goals Posted: 22 Dec 2023 at 9:37am
	We granted your wish and turned MELF solder joint goals into incremental pad stacks per the Nominal Diameter in V24.02 pre-release dated today 12/22/2023. New Nominal Diameter Ranges – Dia. < 1.00 Dia. >= 1.00, < 2.00 Dia. >= 2.00, < 3.00 Dia. >= 3.00, < 4.00 Dia. > 4.00 Now you can control the Toe, Heel and Side for MELF Resistors, Diodes and Fuses. Thank you for recommending this feature. V24.02 will be officially released next week - www.pcblibraries.com/downloads
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jde0503 Members Profile Send Private Message Find Members Posts Add to Buddy List Active User Joined: 10 May 2023 Status: Offline Points: 13	Post Options Post Reply Quote jde0503 Report Post Thanks(0) Quote Reply Posted: 20 Jul 2023 at 9:40am
	Devices with Cylindrical End Cap terminations should have different groups of toe/heel/side solder goals based on device height/length/width. This has been done with rectangular end cap devices and should similarly be done for cylindrical. There's no reason to have a part that is twice the size have the same toe/heel/side solder goals. This leads to wildly undersized or oversized pads.