Pad Stack Name for Through Hole Parts |
Post Reply |
Author | |
PLTcbv
Advanced User Joined: 21 Aug 2012 Location: the Netherlands Status: Offline Points: 134 |
Post Options
Thanks(0)
Posted: 25 Sep 2014 at 1:43am |
If I create a Through Hole part with the LE Lite 2014.11 and do an Expedition ASCII out the Padstack name used in the part is not correct.
Padstack created: c150m160h100t140_180_34 Padstack Naming Convention: c150h90m165 Hole and Mask position in Padstack name are different. Which is correct? Regards, Wim.
|
|
Tom H
Admin Group Joined: 05 Jan 2012 Location: San Diego, CA Status: Offline Points: 5716 |
Post Options
Thanks(0)
|
It totally depends on what "Environment" you are using. If you are using IPC-7251 Level A, B & C then the Pad Stack name = c150h90m165 If you are using Proportional Environment the Pad Stack name = c150m160h100t140_180_34 For the Proportional Environment the Thermal Relief ID t140_180_34 is added because the way IPC-7251 calculates Thermal Relief is entirely different than Proportional. IPC uses the Pad Size to calculate Thermal Relief and Proportional uses the Anti-pad to calculate the Thermal Relief. The big difference is that the Anti-pad is a much more stable number because it's calculated by the hole size which is always consistent. The Proportional "Pad Diameter" gets proportionally larger as the hole size grows while the IPC pad stack annular ring is the same regardless if the hole in small or large. |
|
Post Reply | |
Tweet |
Forum Jump | Forum Permissions You cannot post new topics in this forum You cannot reply to topics in this forum You cannot delete your posts in this forum You cannot edit your posts in this forum You cannot create polls in this forum You cannot vote in polls in this forum |