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2013.08 Released!!
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Nick B View Drop Down
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    Posted: 18 Jul 2013 at 9:01am
Version 2013.08 was just released!!
 
NEW:
  • Added the Environment Level letter to the Footprint Name in the Print Feature
  • Pad stack names for IPC include thermal data (2013.08 - 2nd build)

 

FIXED:

  • FP Designer - Assembly outline size not changing
  • FP Designer - Mask and Stencil over/under size added to Through-hole
  • DIP, DIPS, SIP lead size not selecting the correct terminal goals
  • FP Designer Courtyard Crosshair checkbox not enabling
  • Pad stack Designer Proportional goals not setting correctly when ‘Lead Size’ is the source

 
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Nick B View Drop Down
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Joined: 02 Jan 2012
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Points: 1908 		Post Options Post Options   Thanks (0) Thanks(0)   Quote Nick B Quote  Post ReplyReply Direct Link To This Post Posted: 23 Jul 2013 at 4:36pm
A new 2013.08 build resolved these issues:
  • Problem with application of gang mask on Convex chip arrays
  • Problem with vertically oriented slots with round pads
  • Window close 'X' appearing in reference picture
  • Added 'Escape' key to bail on adding pins in FP Designer
  • Added 'Delete' key to remove selected pins

 This update is available as of 7:30EST, July 23, 2013.
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