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Nominal Package Dimensions For Courtyard Excess

Printed From: PCB Libraries Forum
Category: PCB Footprint Expert
Forum Name: Options
Forum Description: the foundation of Footprint Expert's CAD LEAP Technology
URL: https://www.PCBLibraries.com/forum/forum_posts.asp?TID=3662
Printed Date: 17 Jul 2026 at 11:49pm


Topic: Nominal Package Dimensions For Courtyard Excess
Posted By: Nick B
Subject: Nominal Package Dimensions For Courtyard Excess
Date Posted: 16 Jul 2026 at 10:06am
In PCB design, courtyard excess refers to the specific clearance area between the combined physical boundary of a component (body and pads) and the outer boundary of its placement courtyard. This buffer zone ensures that components have sufficient space for manufacturing tolerances, mechanical assembly, and potential rework without interfering with neighboring parts.

Courtyards should not overlap in the part placement. Courtyards are used in a variety of ways in different CAD tools. The courtyard excess values are defined in the 3-Tier density levels for surface mount components.
  • Least Density Level: 0.10 mm
  • Nominal Density Level: 0.20 mm
  • Most Density Level: 0.40 mm
In the https://www.pcblibraries.com/footprintexpert/" rel="nofollow - Footprint Expert , the default courtyard outline maps to the pads and the Maximum package body dimensions. Mapping the courtyard outline to Maximum package body dimensions is affected by package tolerances. Package tolerances vary between component manufacturers affecting the resulting courtyard excess value. There is a Drafting Option switch in the  https://www.pcblibraries.com/footprintexpert/" rel="nofollow - Footprint Expert  to change the courtyard outline to map to the Nominal package body. Using Nominal package body is not affected by package tolerances and provides a consistent courtyard excess for all footprints regardless of the package tolerance values. IPC-7352 only recommends mapping to the Maximum package dimensions, but industry consensus is leaning toward using Nominal package dimensions because component manufacturer tolerances are sometimes too robust and unrealistic.


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