Fixes & Enhancements:

• Calculators:
• Through-hole:
• Removed all instances of a Nominal dimensions from thru-hole footprint names
• Side Concave Package:
• Removed the Assembly Polarity Marker from all non-polarized footprints
• When the Nominal Height and Tolerance is entered to create the Max Height the footprint name used the Nominal dimension 
• Courtyard Excess and Silkscreen Controls:
• Quality control for all Surface Mount and Through-hole calculators and FP Designer Courtyard, Silkscreen controls and spacings including: 
• Line Widths, Clearances, Map-to, Allow Expanded Silkscreen, Offset Silkscreen Away from Body, Expand Courtyard to Include Silkscreen, Contoured Courtyard
• FP Designer:
• Options for 3D Model Polarity was not changing when the footprint was rotated
• Pad Stack Manager:
• Added Chamfer Corner feature on square through-hole pads
• Changed the Keep-out Pad shape option to reflect the hole shape. Enlarging the keepout created an oblong shape.
• Added these modifiers to the pad stack names:
• o = Offset Pad and Solder Mask with the same + / - value
• om = Offset Solder Mask only + / - value
• op = Offset Paste Mask only + / - value
• CAD Tool Interfaces:
• Batch building PADS-To-CAD unique parts was allowing duplicate footprints for the translators
• Guideline:
• Updated the Pad Stack Naming Convention to match FP Designer
• Added EIA / IEC chip case codes to the tables for easy cross reference
• Add chamfered square through-hole pad shapes