http://www.pcblibraries.com/downloads" rel="nofollow -  Fixes & Enhancements: - Options:
- Added a new "Calculation Mode" - Select between Min/Max and Nominal modes
- Note: Nominal Mode adheres to the FED Vol 18 standard - The New Proportional Land Dimensioning Concept
- Purchase the FED Volume 18 publication here for $31 - https://www.fed.de/fed-shop/produkt/4607/" rel="nofollow - https://www.fed.de/fed-shop/produkt/4607/
- Read more about https://www.pcblibraries.com/forum/footprint-expert-nominal-dimension-calculator_topic3450.html" rel="nofollow - Nominal Calculation Mode
- Added "Drafting > Origin" panel for separate controls for Target size, line width and layer
- Flat Lug Lead (DPAK) - updated the solder joint goals
- The on/off switch for Drafting > Assembly "Include Ref Des in Footprint" not switching correctly
- TO-92, TO-220 and all Headers - relocated the Origin to "Center of Body"
- Using an old option file requires manually setting the origin for these component families
- Using Inch dimensions with 4 place decimal accuracy was allowing 4 decimal places but wasn’t allowing any 4th place value to be entered
- Checked that all GUI dimensional text boxes can handle up to 12 characters (fixes inability to add extended decimal place values)
- Using the IPC-7351B.opt file reset the Terminal options to "Internal Defaults"
- CAD Tool Interfaces:
- Altium Designer
- To populate the new Altium default layer assignments, select "Restore Default Settings"
- New Default Layers: https://octopart.com/documentation/style-guide/altium-designer-specific#layers-in-altium-designer" rel="nofollow - https://octopart.com/documentation/style-guide/altium-designer-specific#layers-in-altium-designer
- Changed .Designator justification to Center/Center at location 0,0 on Layer 11
- Added a .Designator2 to Top Assembly Layer 9
- Relocated the Footprint Origin Marker to Layer 17
- Pin-in-Paste technology for through-hole pad stacks not translating correctly
- Cadence Allegro/OrCAD PCB
- Added 24.1
- FP Designer manual pin 1 dot not translating
- FP Designer slotted hole not rotating correctly
- FP Designer Bottom Layer SMD pad stack not translating correctly
- FP Designer:
- Fixed erratic Pad Stack Manager display behavior for different pad corner configurations
- Dropped the "r" from the pad stack name when the radius is zero
- When moving Calculator footprint to FP Designer, the Assembly and 3D STEP polarity was not translating correctly
- Added the ability to create round paste mask apertures on Thermal Pads
- Updated the pad stack name for bottom side SMD pads
- Calculators:
- Terminal type not added to the component to the SOD when the dimensions required automatic terminal type change from gullwing to outward L
- Fixed display of zero values in component dimensions when allowable (for A1 for example)
- Fixed gang mask generation for 2 pin parts
- Through-hole Axial Lead - added Ferrite Bead component family
- QFN with no thermal pad - changing the L1 dimension affected the G1 dimension
- LED 3D Color changes were not changing in the image, but OK in the CAD tool
- Through-hole TO Cylindrical moved the drafting outline tab to the last pin and added "Set New Pin 1" feature
- Through-hole Radial footprints could not move to FP Designer
- QFP - updated the IPC-7351B footprint naming convention. Removed duplicate pin qty.
- All SOT Component Families - updated Footprint Name to add the Body Length
- Middle Mouse Wheel scrolling Up/Down was swapped to match all Microsoft programs
- When inserting Nominal package dimensions with zero tolerance, only the Min/Max dimensions should display
- 3D STEP Models:
- Right Angle Headers 3D STEP Model body shift when origin is on the body center
- TO-92 and TO-220 Vert. 3D STEP Model body shift when origin is on the body center
- 3D STEP Translator: changed the UI text Include - Suffix in "Footprint" Name to "3D Model" Name
- Updated the Through-hole "Vertical Flange Mount" terminal lead orientation
- Library Editor:
- The Footprint Date column was not adding the Time
- Drafting Symbols:
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