Hello,
how can I define additional settings when generating outputs (Padstacks) for Siemens EDA - Xpedition?
Currently when generating Padstack.hkp files to be imported into EDM Librarian the names for PADs/HOLEs are very rudimentary and do not follow the Xpedtion naming scheme nor the IPC recommendation.
When generating an unencrypted ASCII export I've also noticed that the option "AUTO_GENERATED_NAME" is set for Holes which than isn't true.
Therefore now my question: How can I influence the definition of the pad/hole names and the additional settings as marked in the example?
Thanks. Poldi
Example: ################################### .FILETYPE PADSTACK_LIBRARY .VERSION "02.00" .CREATOR "PCB Libraries FPX Expert" .DATE "Thursday, August 31, 2023 4:45:42 PM"
.UNITS MM
.PAD "Round 1.28mm" ..ROUND ...DIAMETER 1.28 ..OFFSET (0, 0)
.PAD "Thermal 1.635mm" ..4_WEB_ROUND_THERMAL_45 ...DIAMETER 1.635 ...TIE_LEG_WIDTH 0.307 ...THERMAL_CLEARANCE 0.1925 ..OFFSET (0, 0)
.PAD "Round 1.635mm" ..ROUND ...DIAMETER 1.635 ..OFFSET (0, 0)
.HOLE "Rnd 0.85" ..ROUND ...DIAMETER 0.85 ..POSITIVE_TOLERANCE 0.08 ..NEGATIVE_TOLERANCE 0.08 ..HOLE_OPTIONS PLATED DRILLED AUTO_GENERATED_NAME ..DEPTH_ASSIGNMENT_METHOD THROUGH_HOLE ..DRILL_SYMBOL ...ASSIGN_DURING_OUTPUT ....SIZE 1.5
.PADSTACK "c128h85" ..PADSTACK_TYPE PIN_THROUGH ..TECHNOLOGY "(Default)" ...TECHNOLOGY_OPTIONS NONE ...TOP_PAD "Round 1.28mm" ...INTERNAL_PAD "Round 1.28mm" ...BOTTOM_PAD "Round 1.28mm" ...CLEARANCE_PAD "Round 1.635mm" ...THERMAL_PAD "Thermal 1.635mm" ...TOP_SOLDERMASK_PAD "Round 1.28mm" ...BOTTOM_SOLDERMASK_PAD "Round 1.28mm" ...HOLE_NAME "Rnd 0.85" ....OFFSET (0, 0) ###################################
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