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Footprint Expert 23.02 Released!!

Printed From: PCB Libraries Forum
Category: PCB Footprint Expert
Forum Name: Version History
Forum Description: software version release announcements & history
URL: https://www.PCBLibraries.com/forum/forum_posts.asp?TID=3210
Printed Date: 24 Nov 2024 at 11:11pm


Topic: Footprint Expert 23.02 Released!!
Posted By: Nick B
Subject: Footprint Expert 23.02 Released!!
Date Posted: 17 Jan 2023 at 9:15am
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Fixes & Enhancements:
  • Resolved FIPS issue
  • Options:
    • Console Options was not restoring the component outline color if it was changed and restored
  • FP Designer:
    • Added a new feature – the silkscreen and assembly outlines now map to the outside of the package body outline
    • Assign Pins – Pin reorder was not working 100%
  • Physical Description Text File:
    • Updated the Physical Descriptions for all footprints with Thermal Pads
    • This impacted physical descriptions for footprints created in FP Designer 
  • Calculators:
    • Chip and MELF Assembly Ref Des was using the wrong package dimension to calculate the height
    • Resolved issues with Footprint Names:
      • DFN 2, 3, 4 – duplicating pin quantity
      • DPAK missing a tab dimension
      • SOJ & SOL, and OSCJ & OSCL & Crystal was using lead span E instead of body dimension of E1


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