Likewise, for MELF's... I think I'm pretty safe just reusing the footprint that I made for a Microsemi MELF (even if it's a different manufacturer... as long as it's the same JEDEC package). I'm thinking SOT-23's are probably pretty close (I'd need different versions to account for pin mapping... but physical dimensions are pretty close).

But there's some parts where it seems like there's enough variation (like DPAK's which might have a different thermal pad design, from one manufacturer to another)?

So I'm wondering, if there's other standard JEDEC packages, where you're going to want to make device specific footprints because there actually is variation in their dimensions... you can't just reuse a footprint that you made for another part that had same JEDEC package?

Thanks! Chris

Same goes for every component family. 

Take all your vendors for any specific package and throw out all High and Low tolerances for the Body and terminal dimensions. 

What many companies are starting to do is just use the nominal dimensions for each package with 0.00 tolerance. They are also removing the Fabrication and Assembly tolerances from the footprint calculation. This provides very stable footprint patterns and greatly reduces the size of the PCB library. 

As all machines for package creation, fabrication and assembly get more accurate I'm am seeing this as the long term future of the PCB library industry. There will be no more "Tolerances" or they will become insignificant.