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Non-collapsing vs Collapsing BGA Balls

Printed From: PCB Libraries Forum
Category: PCB Footprint Expert
Forum Name: Questions & Answers
Forum Description: issues and technical support
URL: https://www.PCBLibraries.com/forum/forum_posts.asp?TID=1708
Printed Date: 07 Oct 2024 at 3:18pm


Topic: Non-collapsing vs Collapsing BGA Balls
Posted By: tatets
Subject: Non-collapsing vs Collapsing BGA Balls
Date Posted: 10 Jun 2015 at 8:30pm
Hi,

Looking at the tables below, for non-collapsing we use 0.25 (or less) nominal land diameter  for 0.50mm pitch packages. Question is, should 0.30-0.75 ball diameter still applicable for 0.500 pitch packages? Will the land pads not cause any bridging due to space constraints?

Similary, for collapsing we use 0.30 (or higher) nominal land diameter for 0.65mm pitch packages. Question is, should 0.15-0.25 ball diameter still applicable for 0.65 pitch packages? Will the land pads not cause any reliability issues due to smaller pads?

Thanks in advance for your help.

Collapsing Ball

Non-collapsing
Non-collapsing




Replies:
Posted By: Tom H
Date Posted: 11 Jun 2015 at 7:19am
Question is, should 0.30-0.75 ball diameter still applicable for 0.500 pitch packages?
Question is, should 0.15-0.25 ball diameter still applicable for 0.65 pitch packages?
 
Here is the Ball Size to Pin Pitch table from IPC-7351B:
 
 


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Posted By: tatets
Date Posted: 16 Jun 2015 at 7:09pm
Thanks a million Tom!



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