Good question! I've been in the PCB library industry since 1981 when I built every footprint in the electronics industry on Computervision CAD tool. It was less than 5,000 unique packages but they were all JEDEC "Standard" packages except the connectors were all 100 mil pitch. Sold the first libraries on magnetic tape. Today there are over 100 times that many (500,000) unique packages of which 50% are connectors or non-standard packages and this category has been growing steady. I like the IPC-7351 Land Pattern Naming Convention. But we are opening "Parts on Demand" (POD) website this weekend and there will be 200,000 unique mfr. Part Numbers to kick it off and we're adding 5,000 new Part Numbers every day. We were forced to introduce 3 new modifiers in the Land Pattern names - Gull Wing Terminal Tolerance, BGA Ball Size, Thermal Tab Size in order to reduce the duplication in Land Pattern Names where the component dimensions were identical but the lead tolerances, ball sizes and thermal tab sizes are all over the map and produce different footprint results. So component packages used to be 100% standard and now they are 50% standard and in the future the standard package % could go down if history is a measurement of a trend. So my personal belief is that by the year 2016, ALL footprint names will be switched over to MfrName_MfrPartNumber to have a 100% consistent naming convention. However, this will introduce major duplication because Texas Instruments has 8,000 different Part Numbers that all use the same SOP 8-pin package. I don't see a problem because libraries will either be free or very inexpensive and available on demand and memory space will be plentiful. The average hard disk drive in 2016 will be 2TB minimum. I already have three 2TB drives. It's better to associate your footprint names with the mfr. part number to totally eliminate errors and duplication because the IPC-7351 naming convention was intended to handle "Standard Packages", but these will be in the minority in a couple years.
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