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New 2016 Solder Joint Goals | 
 
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   Tom H  
   
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     Posted: 11 Sep 2019 at 7:33pm | 
 
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   There is a Pas Size Round-off in the Preferences or the "Terminal > Settings" tab.  
   
  Change the Pad Size Round-off to 0.05 or whatever you want.   | 
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   5not4  
   
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   Joined: 09 Jul 2013 Status: Offline Points: 40  | 
  
   
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     Posted: 13 Sep 2019 at 7:41am | 
 
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Hi Tom. 
   
  What is to be considered the starting point for the toe? Lead length? Or landing pad length? Nominal, max?  I haven't been able to locate any documentation that indicates where this starting point is. I don't have a copy of the IPC-J-STD-001 yet. Hope to have that soon.  
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   Tom H  
   
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     Posted: 13 Sep 2019 at 7:53am | 
 
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   IPC-J-STD-001 clearly states that the Toe solder joint goal should be a minimum of 25% of the Terminal Height or 0.50 mm, whichever is greater.  
   
  Look in the Tables.   | 
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   lsday  
   
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     Posted: 24 Sep 2019 at 7:47am | 
 
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I do want to change the pad round off to be 0.05. Where would I do that globally? For all packages?
    
   
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   Tom H  
   
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     Posted: 24 Sep 2019 at 7:57am | 
 
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   Preferences > Terminals > Corner Concave > Settings > Pad Size Roundoff  
   
  As soon as you select another Terminal like "Cylindrical End Cap" you will get a notification:  Apply Setting Changes to all surface mount terminals? Yes or No  | 
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   lsday  
   
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     Posted: 24 Sep 2019 at 8:05am | 
 
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Awesome! Just did it. Thanks Tom!
    
   
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   Tom H  
   
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     Posted: 24 Sep 2019 at 8:07am | 
 
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   Don't forget to change Through-hole too.  
   
  Preferences > Terminals > Through-hole > Pad Size Round-off.  ![]()  | 
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   ted.brinc  
   
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     Posted: 07 Sep 2023 at 2:58pm | 
 
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   I don't see a solder joint goals download anymore.  Is the methodology obsolete?
    
   
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   Tom H  
   
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     Posted: 07 Sep 2023 at 3:04pm | 
 
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   It's on your computer in the directory folder:  
   
  C:\Program Files (x86)\PCB Libraries\Footprint Expert 23\Documents File name - Footprint Expert Surface Mount Families.pdf 
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