Footprint Expert 25.05 Released!!

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   Version 25.05 was just released!!
Fixes & Enhancements:
Free Calculator: 
Turned on the local options for Terminal Density Level
Unique Footprints:
The Silkscreen Ref Des was not generated
FP Designer
Pad Stack Designer:
Some display and functional issues when using non-millimeter units
Through Hole roundoffs now works for all unit types (mm, mils. etc.)
New feature for setting Units for pad stack dimensions and pad stack names
Pad Stack Manager generated names not following Design Option for pad stack name units
Calculators:
DPAK - updated the calculation for the large thermal pad
DPAK - 2-Pin version throwing an exception
SON - the 'G' pad stack dimension value was assigned to the longer pin 1 and not the other pins
SON - the mfr.'s footprint showing the wrong dimension value for 'G'
DFN 3-Pin - 'G' and 'G1' pad stack dimension values were swapped
DFN 4-Pin - not showing a trim warning when the 'G1' dimension is trimmed
QFN - thermal pad 'r' and 'c' cells that were blank were unintentionally populated with 0.00 when opening a footprint
PQFN & PSON mfr.'s footprint reference drawing erroneously showing a long pin 1' x 1' option
Chip Array, 4-Sided - the 'G1' pad stack dimension value was 6 places and not following the Design Options

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Nick B Members Profile Send Private Message Find Members Posts Add to Buddy List Admin Group Joined: 02 Jan 2012 Status: Offline Points: 1953	Post Options Post Reply Quote Nick B Report Post Thanks(0) Quote Reply Topic: Footprint Expert 25.05 Released!! Posted: 11 Apr 2025 at 12:58pm
	Version 25.05 was just released!! Fixes & Enhancements: Free Calculator: Turned on the local options for Terminal Density Level Unique Footprints: The Silkscreen Ref Des was not generated FP Designer Pad Stack Designer: Some display and functional issues when using non-millimeter units Through Hole roundoffs now works for all unit types (mm, mils. etc.) New feature for setting Units for pad stack dimensions and pad stack names Pad Stack Manager generated names not following Design Option for pad stack name units Calculators: DPAK - updated the calculation for the large thermal pad DPAK - 2-Pin version throwing an exception SON - the 'G' pad stack dimension value was assigned to the longer pin 1 and not the other pins SON - the mfr.'s footprint showing the wrong dimension value for 'G' DFN 3-Pin - 'G' and 'G1' pad stack dimension values were swapped DFN 4-Pin - not showing a trim warning when the 'G1' dimension is trimmed QFN - thermal pad 'r' and 'c' cells that were blank were unintentionally populated with 0.00 when opening a footprint PQFN & PSON mfr.'s footprint reference drawing erroneously showing a long pin 1' x 1' option Chip Array, 4-Sided - the 'G1' pad stack dimension value was 6 places and not following the Design Options
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