PCB Libraries Forum Homepage
Forum Home Forum Home > General > General Discussion
  New Posts New Posts RSS Feed - Minimum Trace Width/Spacing for BGA
  FAQ FAQ  Forum Search   Events   Register Register  Login Login

Minimum Trace Width/Spacing for BGA

 Post Reply Post Reply
Author
Message
SandroLanot View Drop Down
New User
New User


Joined: 11 Feb 2015
Status: Offline
Points: 13
Post Options Post Options   Thanks (0) Thanks(0)   Quote SandroLanot Quote  Post ReplyReply Direct Link To This Post Topic: Minimum Trace Width/Spacing for BGA
    Posted: 11 Feb 2015 at 3:03pm

Guys (& Gals),

Can somebody please help advice what is the min trace width/spacing for 0.80 mm x 0.80 BGA?

Thanks!
Back to Top
Back to Top
Tom H View Drop Down
Admin Group
Admin Group
Avatar

Joined: 05 Jan 2012
Location: San Diego, CA
Status: Offline
Points: 5718
Post Options Post Options   Thanks (1) Thanks(1)   Quote Tom H Quote  Post ReplyReply Direct Link To This Post Posted: 11 Feb 2015 at 3:12pm

The numbers in Green are Mils.

Stay connected - follow us! X - LinkedIn
Back to Top
SandroLanot View Drop Down
New User
New User


Joined: 11 Feb 2015
Status: Offline
Points: 13
Post Options Post Options   Thanks (0) Thanks(0)   Quote SandroLanot Quote  Post ReplyReply Direct Link To This Post Posted: 11 Feb 2015 at 5:35pm
Thank you Tom,

Actually, my plan is to use VIA18D9A26P (plugged from top open on bottom) if not near a pad on the bottom, and VIA18D9A26PTB plugged and cover with solder mask from both sides.


Back to Top
Tom H View Drop Down
Admin Group
Admin Group
Avatar

Joined: 05 Jan 2012
Location: San Diego, CA
Status: Offline
Points: 5718
Post Options Post Options   Thanks (2) Thanks(2)   Quote Tom H Quote  Post ReplyReply Direct Link To This Post Posted: 11 Feb 2015 at 7:46pm

Yes, I would highly recommend that you "Tent" the vias on the BGA side and leave the holes open on the bottom side.

If you plug both sides, super heated gas in the hole could pop through the top or bottom solder mask but if you leave the bottom open it will let the heated gas during assembly reflow escape.

If you want to cover both top and bottom holes I recommend that you fill the holes with something (over-plate, silver epoxy, solder mask) to eliminate the air in the hole.

Super heated trapped air does things in assembly that damage the finished product. The last thing you need is popped air through solder mask under a BGA that you can't see.


Stay connected - follow us! X - LinkedIn
Back to Top
 Post Reply Post Reply

Forum Jump Forum Permissions View Drop Down



This page was generated in 0.188 seconds.