TXS02612RTWR Footprint Issues

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Hi! 
I downloaded TXS02612RTWR footprint and have some issues with it:
"Dublicate pin name 25 exists in...." message during CAD export wizard in Library Expert.
Short circuit violation on every pin in Altium during DRC check. "[Short-Circuit Constraint Violation] PCB.PcbDoc Advanced PCB Short-Circuit Constraint: Between Region (0 hole(s)) Top Layer And Pad IC?-10 (52.25 mm, 43.025 mm)  Top Layer Location : [X = 1121.95mm][Y = 648.925 mm]"
Unable to apply "solder mask/paste expansion" rules to pads when footprint placed on PCB.

What is wrong with this part ?

Thanks a lot!

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toshas Members Profile Send Private Message Find Members Posts Add to Buddy List Advanced User Joined: 03 Jul 2017 Status: Offline Points: 71	Post Options Post Reply Quote toshas Report Post Thanks(0) Quote Reply Topic: TXS02612RTWR Footprint Issues Posted: 30 Oct 2017 at 10:45am
	Hi! I downloaded TXS02612RTWR footprint and have some issues with it: "Dublicate pin name 25 exists in...." message during CAD export wizard in Library Expert. Short circuit violation on every pin in Altium during DRC check. "[Short-Circuit Constraint Violation] PCB.PcbDoc Advanced PCB Short-Circuit Constraint: Between Region (0 hole(s)) Top Layer And Pad IC?-10 (52.25 mm, 43.025 mm) Top Layer Location : [X = 1121.95mm][Y = 648.925 mm]" Unable to apply "solder mask/paste expansion" rules to pads when footprint placed on PCB. What is wrong with this part ? Thanks a lot!



toshas Members Profile Send Private Message Find Members Posts Add to Buddy List Advanced User Joined: 03 Jul 2017 Status: Offline Points: 71	Post Options Post Reply Quote toshas Report Post Thanks(0) Quote Reply Posted: 30 Oct 2017 at 12:38pm
	2-3 solved! Actually Altium does not support D-Shape pads. After replacement D-Shape to Oblong 2-3 are gone.

Tom H Members Profile Send Private Message Find Members Posts Add to Buddy List Admin Group Joined: 05 Jan 2012 Location: San Diego, CA Status: Offline Points: 5718	Post Options Post Reply Quote Tom H Report Post Thanks(0) Quote Reply Posted: 30 Oct 2017 at 12:42pm
	There are duplicate Pin Names for the Thermal Pad Vias. Altium can handle multiple pins with the same pin name. If not, delete the via pad stack and resave the part.
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Tom H Members Profile Send Private Message Find Members Posts Add to Buddy List Admin Group Joined: 05 Jan 2012 Location: San Diego, CA Status: Offline Points: 5718	Post Options Post Reply Quote Tom H Report Post Thanks(0) Quote Reply Posted: 30 Oct 2017 at 1:52pm
	We updated the Texas Instruments part on POD to allow you to use your default pad shape in Preferences. The part was converted from FP Designer to the Calculator for a better 3D STEP model.
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toshas Members Profile Send Private Message Find Members Posts Add to Buddy List Advanced User Joined: 03 Jul 2017 Status: Offline Points: 71	Post Options Post Reply Quote toshas Report Post Thanks(0) Quote Reply Posted: 30 Oct 2017 at 10:13pm
	Thanks a lot!

toshas Members Profile Send Private Message Find Members Posts Add to Buddy List Advanced User Joined: 03 Jul 2017 Status: Offline Points: 71	Post Options Post Reply Quote toshas Report Post Thanks(0) Quote Reply Posted: 31 Oct 2017 at 4:13am
	Now I was able to export in Altium without any issues. Thanks! I'm working on prototype board and new footprint will be ok for it. But other users may prefer old footprint (which was made exactly per datasheet recomendations: with thermal via and so on). Is it possible to keep both ones in PCB Library ? Without direct replacement ? Thanks again!

Tom H Members Profile Send Private Message Find Members Posts Add to Buddy List Admin Group Joined: 05 Jan 2012 Location: San Diego, CA Status: Offline Points: 5718	Post Options Post Reply Quote Tom H Report Post Thanks(0) Quote Reply Posted: 31 Oct 2017 at 6:14am
	The TI footprint that you originally downloaded was created in FP Designer. If the part is created in the Calculator then anyone can apply their preferences for Solder Mask swell, Pad Shape, Paste Mask Reduction and use the mfr. recommended pattern. You can also move the footprint from the Calculator to FP Designer to add the via matrix for the Thermal Pad. Keeping the part in the Calculator will produce a better 3D STEP model.
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