PCB Libraries Forum Homepage
Forum Home Forum Home > PCB Footprint Expert > Version History
  New Posts New Posts RSS Feed - Library Expert 2016.03 Released!!
  FAQ FAQ  Forum Search   Events   Register Register  Login Login

Library Expert 2016.03 Released!!

 Post Reply Post Reply
Author
Message
Nick B View Drop Down
Admin Group
Admin Group


Joined: 02 Jan 2012
Status: Offline
Points: 1908
Post Options Post Options   Thanks (0) Thanks(0)   Quote Nick B Quote  Post ReplyReply Direct Link To This Post Topic: Library Expert 2016.03 Released!!
    Posted: 16 Apr 2016 at 4:03pm

NEW / ENHANCED:
  • General:
    • New installation certificate to prevent Windows 10's SmartScreen false alarm alert
  • Main Toolbar:
    • Relocated the “Parts on Demand” icon from the “Library Editor” toolbar to the “Main” toolbar
  • Calculator:
    • Update PTH TO-220 to add Alpha-numeric pin assignments
  • Preferences:
    • Updated the Components tree to add PSON and PQFN
  • FP Designer:
    • Updated the Finish Tab to allow the user to enter Case Code and make that the Footprint Name
    • Updated Non-plated hole pad shape from “Donut” to “None”
    • Updated the pad stack name when the inner layer pad size is different than the outer layers
  • Tools > PADS to CAD:
    • When you enter either a part type or a part decal filename, the program will check if the other file is available, and automatically fill in both boxes
    • Now reads free-form text properly
    • Through-hole parts will now have proper naming that uses the h value to denote hole size
  • Expedition:
    • Adjusted the ASCII Keep-out translation to support Placement Keep-outs along with Plane Obstructs. Trace and Via are now separated should one be excluded.
    • If the Top Pad of a Pad Stack is Complex, while the regular Pad Stack name is not, the two values will be concatenated together, spaces will be removed, and COMPLEX will be shortened to CMPX. This should kill any potential naming collisions with regular pads in Expedition.
      Ex: s100s86_CMPX_12.2X19.5_A237.9_S1
    • Fixed a problem in the ASCII output that was causing MILS not to work. Microns and Inches should also work properly now.
    • Mixed (having Parts and Pad Stacks of more than one Unit type) ASCII is now fully supported
    • Added a Translation Target Type of ASCII per customer request. This will allow the output of plain vanilla ASCII files before they’re Encrypted. Useful if you have Expedition 2007 or earlier. Use the Encrypted ASCII selection for anything later.
    • Fixed various conversion issues
  • Altium:
    • Pin Shapes on Paste Mask Bottom now import properly
    • The Altium Translator now supports the ability to declare a layer from eMechanical1 to eMechanical50. Any mapping value over 50 will get set to layer eMechanical50.

 

FIXED:

  • 3D STEP:
    • Fixed unit conversion issues for the BGA, CGA, LGA, and DIP families
    • XTALDFN – Fixed an issue in the 3D Model calculation that was generating improper data
    • Fixed an issue with QFN/PQFN rounded and rounded/chamfer thermal tabs that was causing it to display slightly incorrect leads
  • Preferences:
    • Terminals > Through-hole > Hole Over Square Lead – was confused with Hole Over Round Lead
    • Drafting > Assembly > Ref des > Zero – changing the value to zero caused Unhandled Exception Errors
    • Files tab > Number of Backups – causing problems when the FPX file was on a network drive
  • Allegro/OrCAD PCB:
    • Parts with a circular courtyard diameter over 0.50 mm (to exclude the origin crosshair) now import properly as shapes, rather than circles. This will allow the package height to import properly for circular parts.
    • Circular parts now also mirror the PLACE_BOUND_TOP courtyard to DFA_BOUND_TOP
  • EAGLE:
    • Fixed an issue that was suppressing attached copper in certain circumstances

 

Stay connected - follow us! X - LinkedIn
Back to Top
Back to Top
 Post Reply Post Reply

Forum Jump Forum Permissions View Drop Down



This page was generated in 0.172 seconds.