J-STD-001: Plated Through-hole Obstruction

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   IPC-J-STD-001 identifies Hole Obstruction as “Parts
and components shall be mounted such that they do not obstruct solder flow onto
the solder destination side lands (pads) of plated through holes (PTH’s)
required to be soldered”. 

Example of Hole Obstruction: 

This issue pertains to through-hole terminals that are under the component package where the bottom of the package sits directly on the PCB surface and can be resolved by simply lifting the component package slightly off to PCB surface. IPC-J-STD-001 states minimal acceptable conditions for supported holes for through-hole terminals are Acceptable for Class 1, Process Indicator for Class 2 (means the assembly process can be improved) and a Defect for Class 3. 
The
solder for PTH parts should reveal “Visible Wetting” on the top side of the
PCB. 

To
avoid Hole Obstruction, component manufacturers are forming the package body to
lift it off the PCB allowing the Air in the hole to be pushed out and form an
adequate solder joint. 

4-pin
PTH Oscillator with bottom side bumps:

LED
with Lead Stops to prevent the component body from touching the PCB:

Radial
Capacitor with Kinked Leads to be able to inspect “Visible Wetting”:

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Tom H Members Profile Send Private Message Find Members Posts Add to Buddy List Admin Group Joined: 05 Jan 2012 Location: San Diego, CA Status: Offline Points: 5719	Post Options Post Reply Quote Tom H Report Post Thanks(0) Quote Reply Topic: J-STD-001: Plated Through-hole Obstruction Posted: 15 May 2017 at 6:25pm
	IPC-J-STD-001 identifies Hole Obstruction as “Parts and components shall be mounted such that they do not obstruct solder flow onto the solder destination side lands (pads) of plated through holes (PTH’s) required to be soldered”. Example of Hole Obstruction: This issue pertains to through-hole terminals that are under the component package where the bottom of the package sits directly on the PCB surface and can be resolved by simply lifting the component package slightly off to PCB surface. IPC-J-STD-001 states minimal acceptable conditions for supported holes for through-hole terminals are Acceptable for Class 1, Process Indicator for Class 2 (means the assembly process can be improved) and a Defect for Class 3. The solder for PTH parts should reveal “Visible Wetting” on the top side of the PCB. To avoid Hole Obstruction, component manufacturers are forming the package body to lift it off the PCB allowing the Air in the hole to be pushed out and form an adequate solder joint. 4-pin PTH Oscillator with bottom side bumps: LED with Lead Stops to prevent the component body from touching the PCB: Radial Capacitor with Kinked Leads to be able to inspect “Visible Wetting”:
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JamesUS Members Profile Send Private Message Find Members Posts Add to Buddy List New User Joined: 26 Jun 2017 Status: Offline Points: 6	Post Options Post Reply Quote JamesUS Report Post Thanks(0) Quote Reply Posted: 12 Aug 2017 at 7:07am
	Hello, I am beginner to Soldering and IPC Training, as I know the IPC J-STD-001 is a training program which require learning the material in the J-STD-001 specification related to various assembly methods. When I needed some help related to soldering I usually go to www.ipctraining.com.

Anderson Members Profile Send Private Message Find Members Posts Add to Buddy List Active User Joined: 10 Feb 2017 Status: Offline Points: 16	Post Options Post Reply Quote Anderson Report Post Thanks(0) Quote Reply Posted: 06 Oct 2017 at 2:46am
	I learned many things till now online but I want to know more, specifically want to get practical knowledge. Is there any blog or tutorials you want to refer me?

Tom H Members Profile Send Private Message Find Members Posts Add to Buddy List Admin Group Joined: 05 Jan 2012 Location: San Diego, CA Status: Offline Points: 5719	Post Options Post Reply Quote Tom H Report Post Thanks(0) Quote Reply Posted: 06 Oct 2017 at 6:55am
	There are some PCB Layout notes that I created here - https://blogs.mentor.com/tom-hausherr/ More will be coming.
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