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Suggestions how to generate a 4 terminal MLCC

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Iain-Trakka View Drop Down
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    Posted: 18 Dec 2023 at 5:01am
Hello,

I'm curious to understand how one would generate a 4 terminal MLCC?

Reference Part: EMCT101W103M1GV001E

I do not see any 'good' starting component types...

Any insight would be greatly appreciated,

Thank you in advance,
Iain
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Post Options Post Options   Thanks (0) Thanks(0)   Quote Tom H Quote  Post ReplyReply Direct Link To This Post Posted: 18 Dec 2023 at 9:46am
You need to use the mfr. recommended pattern and create the Footprint in FP Designer. 

There is no information on solder joint goals for this non-standard Chip package with 3 pins. 

The mfr. needs to provide the pad stack information. 

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Post Options Post Options   Thanks (1) Thanks(1)   Quote Iain-Trakka Quote  Post ReplyReply Direct Link To This Post Posted: 06 Jan 2024 at 1:39pm
Tom,

Thank you for your response and suggestion - I've reached out to the mfg. for their input...

I'll post results here, if possible.

Regards,
Iain
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Post Options Post Options   Thanks (0) Thanks(0)   Quote Iain-Trakka Quote  Post ReplyReply Direct Link To This Post Posted: 12 Jan 2024 at 5:59pm
Tom,

The mfg. came back with land pattern recommendations for the copper layer only, solder/paste mask were not provided. 

is this something that I could request your assistance with via POD request? (or request the part entirely...)

Look forward to your comments,
Iain
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Post Options Post Options   Thanks (0) Thanks(0)   Quote Tom H Quote  Post ReplyReply Direct Link To This Post Posted: 12 Jan 2024 at 6:08pm
Paste Mask is normally 1:1 scale of the pad size. 

A PCB Library can have Solder Mask 2 ways:
  • 1:1 scale and let the fabrication shop swell the solder mask
  • 0.05 is the minimum solder mask annular ring and 0.07 is the nominal and 0.10 is most
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Post Options Post Options   Thanks (0) Thanks(0)   Quote Iain-Trakka Quote  Post ReplyReply Direct Link To This Post Posted: 13 Jan 2024 at 4:12am
Tom,

Thank you for responding - I believe I missed sharing some context on what was puzzling me... 

The part has 4-leads, yet the provided land pattern is three terminals (See Figure 3. Page 10, link below):

(Note, yes this is a different part that I originally stated, yet FP is comparable and it is published data)

Knowing that we'd end up connecting copper between the center two pins (as shown above), would we also extend the mask/paste completely across this center pin? 

Does it make sense to have exposed copper/paste directly under the center of the ceramic body?

Other land patterns that I've seen, all had 4 distinct solder/paste areas (regardless of the copper shapes below)...

Look forward to your comments.

Regards,
Iain
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Post Options Post Options   Thanks (0) Thanks(0)   Quote Tom H Quote  Post ReplyReply Direct Link To This Post Posted: 13 Jan 2024 at 10:05am
You have Pin 1 (left), Pin 2 (right) and Pin 3 (Center).


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Post Options Post Options   Thanks (0) Thanks(0)   Quote Iain-Trakka Quote  Post ReplyReply Direct Link To This Post Posted: 13 Jan 2024 at 11:31am
Tom,

Looking at figure 2, there are 4 distinct pins:


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Post Options Post Options   Thanks (0) Thanks(0)   Quote Tom H Quote  Post ReplyReply Direct Link To This Post Posted: 13 Jan 2024 at 11:38am
Makes no difference. 

Use the mfr. recommended pattern. 

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Post Options Post Options   Thanks (0) Thanks(0)   Quote Iain-Trakka Quote  Post ReplyReply Direct Link To This Post Posted: 13 Jan 2024 at 12:11pm
Okay Tom,

Thank you for the insight.

Regards,
Iain
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