Densly packing tall components |
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NeilVP
New User Joined: 01 Jan 2013 Location: York, England Status: Offline Points: 7 |
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Posted: 26 Feb 2014 at 3:57am |
In my present commission I am required to mount 80+ CAPC6050x500 capacitors into a relatively small area. In experimenting with FP Expert I noticed that the courtyard does not vary with the height of the component and my concern is that placing a lot of tall components, courtyard to courtyard, may cause problems in reflow as there may be problems with shadowing in IR ovens and dead spots if using forced air convection. My questions are - is my concern realistic and are there any further recommendations for this situation?
Many thanks Neil
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Tom H
Admin Group Joined: 05 Jan 2012 Location: San Diego, CA Status: Offline Points: 5718 |
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The FP Designer is Strictly used for Mfr. Recommended Footprint patterns for Non-Standard component packages that do not fit into the IPC Calculator. The user defines the placement courtyard size based on their personal requirements (because the component manufacturer's do not recommend any courtyard dimensional data).
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Tom H
Admin Group Joined: 05 Jan 2012 Location: San Diego, CA Status: Offline Points: 5718 |
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I'm getting the FP Designer and the Library Expert Calculator mixed up here.
The IPC Calculator is just a recommendation (not a hard coded standard). Placement Courtyard sizes for each 3-Tier Environment are -
The User can change the courtyard excess value to anything you want in User Preferences or on the fly in the IPC Calculator. |
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