Footprint Expert 2021.05 Released!!

Message Topic Search Topic Options Post Reply Create New Topic Printable Version Translate Topic

Version 2021.05 was just released!!

Updates & Bugs Fixed:
Library Editor:
Updated the 3D Model Name column to add the file extension .STEP
User Options > Drafting:
Changed the term “Legend” to “Silkscreen”.
Console Options:
Updated the Layer order assignments.
FP Designer:
Fixed an issue with translating older FPX files that had “None” for the Body Outline.
Cleaned up some UI text in the Pad Stack Designer.
Library Editor:
Batch Build did not work on multiple parts.
Updated some TH component family Physical Descriptions to make them consistent with SM. DIP, SIP, OSC, DIPS were updated.
Calculators:
PSON – The mfr. Recommended pattern had a G1 dimension that was not intended. Removed.
PSON – The Silkscreen Legend was not translating to CAD tools.
Vertical Header – Assembly polarity marker did not move with relocating Pin 1.
Vertical Header – Manually inserting package dimensions turned off the Pin Pattern feature.
TO-220 Horizontal – Batch Build does not import 3D STEP.
Axial Lead – The Silkscreen Legend was not translating to CAD tools.
SMD Crystal – The Silkscreen Legend on the lower part was not displaying.
Chip Array Side Concave – The Silkscreen Legend was not translating to CAD tools.

Author	Message Topic Search Topic Options Post Reply Create New Topic Printable Version Translate Topic
Nick B Members Profile Send Private Message Find Members Posts Add to Buddy List Admin Group Joined: 02 Jan 2012 Status: Offline Points: 1908	Post Options Post Reply Quote Nick B Report Post Thanks(0) Quote Reply Topic: Footprint Expert 2021.05 Released!! Posted: 20 May 2021 at 1:18pm
	Version 2021.05 was just released!! Updates & Bugs Fixed: Library Editor: Updated the 3D Model Name column to add the file extension .STEP User Options > Drafting: Changed the term “Legend” to “Silkscreen”. Console Options: Updated the Layer order assignments. FP Designer: Fixed an issue with translating older FPX files that had “None” for the Body Outline. Cleaned up some UI text in the Pad Stack Designer. Library Editor: Batch Build did not work on multiple parts. Updated some TH component family Physical Descriptions to make them consistent with SM. DIP, SIP, OSC, DIPS were updated. Calculators: PSON – The mfr. Recommended pattern had a G1 dimension that was not intended. Removed. PSON – The Silkscreen Legend was not translating to CAD tools. Vertical Header – Assembly polarity marker did not move with relocating Pin 1. Vertical Header – Manually inserting package dimensions turned off the Pin Pattern feature. TO-220 Horizontal – Batch Build does not import 3D STEP. Axial Lead – The Silkscreen Legend was not translating to CAD tools. SMD Crystal – The Silkscreen Legend on the lower part was not displaying. Chip Array Side Concave – The Silkscreen Legend was not translating to CAD tools.
	Stay connected - follow us! X - LinkedIn