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SIP-4L, Diodes |
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saidzaky 
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Joined: 03 Nov 2014 Status: Offline Points: 3 |
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 Topic: SIP-4L, DiodesPosted: 06 Nov 2014 at 7:41am |
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We are working to develop footprint
model for SIP-4L using 2014.12 version and need to build it for Eagle, it would be great if you could help me. this package has 1.27mm pin pitch and its terminal dimensions (0.44 Max & 0.41 Max) mm, there are more details in package drawing in page #5 in this datasheet - www.diodes.com/datasheets/AH276Q.pdf In this case, the Padstack would be c145h85 but the issue is the Padstacks are overlapped What are the right padstack
dimensions (for L, N, M)? |
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Tom H
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Joined: 05 Jan 2012 Location: San Diego, CA Status: Offline Points: 5718 |
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Posted: 06 Nov 2014 at 8:56am |
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I would use FP Designer to create this part in 3 minutes. In V2015.02 there are no 3-Teirs for through-hole. IPC disqualified the IPC-7251 through-hole 3-Teir library system. Read this - http://www.pcblibraries.com/forum/ipc7251-3teir-pth-pad-stack-obsolete_topic1463.html |
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Tom H
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Posted: 06 Nov 2014 at 8:59am |
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I forgot to mention that the FP Designer can do Oblong through-hole pad shape to avoid pad overlap and still provide a good solder joint. |
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saidzaky
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Posted: 16 Nov 2014 at 8:28am |
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Thank you.
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