Square Masks on Round Pads

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   Some BGA manufacturers call for square solder and paste masks on top of round pads.  Can you make these independent options for both standard components and components created with FP Designer?

Thanks, as always,
Kyle

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kwgilpin Members Profile Send Private Message Find Members Posts Add to Buddy List Advanced User Joined: 22 Sep 2012 Status: Offline Points: 58	Post Options Post Reply Quote kwgilpin Report Post Thanks(0) Quote Reply Topic: Square Masks on Round Pads Posted: 10 Sep 2013 at 7:41pm
	Some BGA manufacturers call for square solder and paste masks on top of round pads. Can you make these independent options for both standard components and components created with FP Designer? Thanks, as always, Kyle



Tom H Members Profile Send Private Message Find Members Posts Add to Buddy List Admin Group Joined: 05 Jan 2012 Location: San Diego, CA Status: Offline Points: 5718	Post Options Post Reply Quote Tom H Report Post Thanks(0) Quote Reply Posted: 11 Sep 2013 at 7:41pm
	You can do this in FP Designer. Create your BGA in the Calculator and then convert it to FP Designer. Then select the Pad Stack editor and change the Paste Mask from Round to square with rounded corners.
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Nightwish Members Profile Send Private Message Find Members Posts Add to Buddy List Active User Joined: 20 Feb 2012 Location: Shanghai China Status: Offline Points: 33	Post Options Post Reply Quote Nightwish Report Post Thanks(0) Quote Reply Posted: 12 Sep 2013 at 1:05am
	Our DFME suggest to set the solder paste to Round Rectangular shape instead of a round one. The picture below can show the padstack for BGA in our library. The blue round shape is pad and yellow one is solder mask. The Rnd Rec shape in green is solder paste.

kwgilpin Members Profile Send Private Message Find Members Posts Add to Buddy List Advanced User Joined: 22 Sep 2012 Status: Offline Points: 58	Post Options Post Reply Quote kwgilpin Report Post Thanks(0) Quote Reply Posted: 13 Sep 2013 at 1:37pm
	Hi Tom, Sorry for the slow response. The part in question in STMicro BAL-NRF01D3: http://www.st.com/st-web-ui/static/active/en/resource/technical/document/datasheet/DM00055606.pdf Thanks, Kyle

caclark Members Profile Send Private Message Find Members Posts Add to Buddy List Advanced User Joined: 24 Oct 2012 Location: Cincinnati, OH Status: Offline Points: 177	Post Options Post Reply Quote caclark Report Post Thanks(0) Quote Reply Posted: 12 Nov 2013 at 9:47am
	Our Surface Mount SME also prefers slightly over-sized square paste on round BGA pads (been doing it for several years to all BGA packages with a pitch of 50 or less). We have seen a dramatic improvement on stencil release and pad to ball adhesion during reflow.