Footprint Expert 2022.01 Released!!

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   2022.01 was just released!!

Updates & Bugs Fixed:
Console Options:
IMPORTANT!: If you installed the V2022.01 pre-release you should manually delete ConsoleOptions.opt in this folder
C:\Program Files (x86)\PCB Libraries\Footprint Expert 2022
When you open Footprint Expert it will auto-generate a new ConsoleOptions.opt that you can edit and save
Redesigned the Decimal Place Accuracy Units interface
Add new decimal place accuracy for Pad Size and Pad Place
Options:
Options > Drafting > Silkscreen Line Width:
The Silkscreen Line Widths were not applying the assigned Density Level line width
Options > Components > BGA
If the “Add Fiducials if Pin Pitch” is any value other than 0.00, Batch Build auto-generates Fiducials outside the range specified
FPX File Converter:
3-pin DFN component family was swapping the G & G1 dimensions
3D STEP:
Radial Electrolytic Capacitor component family:
Colorizing Pin 1 was reversed in the 3D STEP output
SMD Aluminum Electrolytic Capacitor: 
Chamfered silkscreen outline was not matching the 3D STEP model chamfer
CFP and CQFP component families
Models were updated to remove the radius edges
All Component Families:
When changing a 3D model color to a Custom color, the color text name now indicates “Custom Color”
Calculators:
DPAK component family:
Fixed an issue where you could not Hide or Delete pins after a pin rename
Chip component family:
Added a new silkscreen outline feature for small chips that could not produce a line without violating the Option rules
CQFP component family with large pin pitch:
Pin 1 polarity line was placing it on the right side of Pin 1
Library Utilities:
The Utilities > Update BOM From Library is the Cloud License version did not work
CAD Interfaces:
Xpedition:
Added .asc file name when outputting ASCII version
PADS Standard:
Changed Version 10 to Version VX
General:
Added a Create and Close button to reduce mouse clicks
Altium:
Outputting 3D STEP added a Density Level Suffix in the .pas file to the 3D model name
Updated the Bottom Side Assembly Outline in the translator to be optional
Added a new feature that auto-deletes the PCBComponent_1 when creating a New Library
Now saves then reopens a library when a new part is added to enable properties
3D STEP:
Translator output was not allowing saving a .STEP file to a separate directory folder 

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Nick B Members Profile Send Private Message Find Members Posts Add to Buddy List Admin Group Joined: 02 Jan 2012 Status: Offline Points: 1908	Post Options Post Reply Quote Nick B Report Post Thanks(0) Quote Reply Topic: Footprint Expert 2022.01 Released!! Posted: 28 Jan 2022 at 4:40pm
	2022.01 was just released!! Updates & Bugs Fixed: Console Options: IMPORTANT!: If you installed the V2022.01 pre-release you should manually delete ConsoleOptions.opt in this folder C:\Program Files (x86)\PCB Libraries\Footprint Expert 2022 When you open Footprint Expert it will auto-generate a new ConsoleOptions.opt that you can edit and save Redesigned the Decimal Place Accuracy Units interface Add new decimal place accuracy for Pad Size and Pad Place Options: Options > Drafting > Silkscreen Line Width: The Silkscreen Line Widths were not applying the assigned Density Level line width Options > Components > BGA If the “Add Fiducials if Pin Pitch” is any value other than 0.00, Batch Build auto-generates Fiducials outside the range specified FPX File Converter: 3-pin DFN component family was swapping the G & G1 dimensions 3D STEP: Radial Electrolytic Capacitor component family: Colorizing Pin 1 was reversed in the 3D STEP output SMD Aluminum Electrolytic Capacitor: Chamfered silkscreen outline was not matching the 3D STEP model chamfer CFP and CQFP component families Models were updated to remove the radius edges All Component Families: When changing a 3D model color to a Custom color, the color text name now indicates “Custom Color” Calculators: DPAK component family: Fixed an issue where you could not Hide or Delete pins after a pin rename Chip component family: Added a new silkscreen outline feature for small chips that could not produce a line without violating the Option rules CQFP component family with large pin pitch: Pin 1 polarity line was placing it on the right side of Pin 1 Library Utilities: The Utilities > Update BOM From Library is the Cloud License version did not work CAD Interfaces: Xpedition: Added .asc file name when outputting ASCII version PADS Standard: Changed Version 10 to Version VX General: Added a Create and Close button to reduce mouse clicks Altium: Outputting 3D STEP added a Density Level Suffix in the .pas file to the 3D model name Updated the Bottom Side Assembly Outline in the translator to be optional Added a new feature that auto-deletes the PCBComponent_1 when creating a New Library Now saves then reopens a library when a new part is added to enable properties 3D STEP: Translator output was not allowing saving a .STEP file to a separate directory folder
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