Library Expert 2017.17 Released!!

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Version 2017.17 was just released!!

NEW / ENHANCED:
Added new user definable Top and Bottom Placement Keep-out Layers to the Interface menu
FIXED:
Calculator:
Molded Body component family – Add D1 dimension
Chip Array component families – Add Ferrite Bead
Side Concave 2/4-pin component family – Add Capacitor
Fixed a silkscreen Legend mapping to body issue in Chips, Molded Body, SOD & SODFL
Updated the graphic thumbnail image for QFP with Thermal Pad was missing the A1 dimension
Preferences:
Updated Through-hole Pad Size round-off to equal the Hole Size round-off
Fixed an issue where changing Preference files required closing and reopening the program before activating the new Preference file
Fixed an issue in the DFN component family for Diode and LED alphanumeric pin names
FP Designer:
Fixed the Rounded Rectangle % to consider the smallest pad dimension instead of relying on the Y dimension only
Fixed an issue in the Pad Stack Designer for chamfered SMD pads with solder mask swell; the chamfer on the solder mask was not 100% accurate
Fixed an issue when moving parts from the Calculator that had mfr. recommended patterns to FP Designer, the program created 2 pad stacks the same size
Altium:
Fixed an error that was suppressing Bottom-side PTH Placement Keep-outs that were attached to pins
Allegro / OrCAD PCB:
Lines have now been added to the batch file to delete pre-existing .PAD or .DRA files; this should allow for regeneration without manual deletion
Fixed an issue where irregular chamfered pads were inverting their corners
Xpedition:
Fixed an issue with PTH Thermal Relief patterns not coming through translator

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Nick B Members Profile Send Private Message Find Members Posts Add to Buddy List Admin Group Joined: 02 Jan 2012 Status: Offline Points: 1904	Post Options Post Reply Quote Nick B Report Post Thanks(0) Quote Reply Topic: Library Expert 2017.17 Released!! Posted: 04 Sep 2017 at 6:33am
	Version 2017.17 was just released!! NEW / ENHANCED: Added new user definable Top and Bottom Placement Keep-out Layers to the Interface menu FIXED: Calculator: Molded Body component family – Add D1 dimension Chip Array component families – Add Ferrite Bead Side Concave 2/4-pin component family – Add Capacitor Fixed a silkscreen Legend mapping to body issue in Chips, Molded Body, SOD & SODFL Updated the graphic thumbnail image for QFP with Thermal Pad was missing the A1 dimension Preferences: Updated Through-hole Pad Size round-off to equal the Hole Size round-off Fixed an issue where changing Preference files required closing and reopening the program before activating the new Preference file Fixed an issue in the DFN component family for Diode and LED alphanumeric pin names FP Designer: Fixed the Rounded Rectangle % to consider the smallest pad dimension instead of relying on the Y dimension only Fixed an issue in the Pad Stack Designer for chamfered SMD pads with solder mask swell; the chamfer on the solder mask was not 100% accurate Fixed an issue when moving parts from the Calculator that had mfr. recommended patterns to FP Designer, the program created 2 pad stacks the same size Altium: Fixed an error that was suppressing Bottom-side PTH Placement Keep-outs that were attached to pins Allegro / OrCAD PCB: Lines have now been added to the batch file to delete pre-existing .PAD or .DRA files; this should allow for regeneration without manual deletion Fixed an issue where irregular chamfered pads were inverting their corners Xpedition: Fixed an issue with PTH Thermal Relief patterns not coming through translator
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