Naming Convention On The Molded Capacitor |
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robmeyer
Advanced User Joined: 04 Oct 2012 Status: Offline Points: 113 |
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Posted: 25 Feb 2015 at 4:28am |
Hi,
When I build a Polarized Molded Capacitor the naming of the Footprint is wrong. In 2015.08 it is CAPPM. Robert |
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Tom H
Admin Group Joined: 05 Jan 2012 Location: San Diego, CA Status: Offline Points: 5717 |
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In
the Molded Body calculator the auto-generated names are:
Note that the prefix always ends in M for molded body. |
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robmeyer
Advanced User Joined: 04 Oct 2012 Status: Offline Points: 113 |
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Some days before it was the other typo (CAPMP). Also in your pdf. In the downloadable fpx file the CAPMP is also used. And the POD also have this CAPMP naming.
So is the question why changing a naming convention that works for years? |
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Tom H
Admin Group Joined: 05 Jan 2012 Location: San Diego, CA Status: Offline Points: 5717 |
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Because the "M" (for the package type Molded Body) really should be at the end of the Footprint Name Prefix.
Our goal is to correct flaws to improve the standard for the future. |
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Ian S
Advanced User Joined: 21 Aug 2014 Status: Offline Points: 67 |
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In which case, you may wish to correct the remaining typo in the Naming Convention PDF: CAPPC instead of CAPCP
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Tom H
Admin Group Joined: 05 Jan 2012 Location: San Diego, CA Status: Offline Points: 5717 |
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The Library Expert already produces a CAPPC footprint name.
The Footprint Naming Convention document was updated - Footprint_Naming_Convention_-_Surface_Mount.zip
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