Minimum Trace Width/Spacing for BGA

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   Guys (& Gals),
Can somebody please help advice what is the min trace width/spacing for 0.80 mm x 0.80 BGA?

Thanks!

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SandroLanot Members Profile Send Private Message Find Members Posts Add to Buddy List New User Joined: 11 Feb 2015 Status: Offline Points: 13	Post Options Post Reply Quote SandroLanot Report Post Thanks(0) Quote Reply Topic: Minimum Trace Width/Spacing for BGA Posted: 11 Feb 2015 at 3:03pm
	Guys (& Gals), Can somebody please help advice what is the min trace width/spacing for 0.80 mm x 0.80 BGA? Thanks!



Tom H Members Profile Send Private Message Find Members Posts Add to Buddy List Admin Group Joined: 05 Jan 2012 Location: San Diego, CA Status: Offline Points: 5716	Post Options Post Reply Quote Tom H Report Post Thanks(1) Quote Reply Posted: 11 Feb 2015 at 3:12pm
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SandroLanot Members Profile Send Private Message Find Members Posts Add to Buddy List New User Joined: 11 Feb 2015 Status: Offline Points: 13	Post Options Post Reply Quote SandroLanot Report Post Thanks(0) Quote Reply Posted: 11 Feb 2015 at 5:35pm
	Thank you Tom, Actually, my plan is to use VIA18D9A26P (plugged from top open on bottom) if not near a pad on the bottom, and VIA18D9A26PTB plugged and cover with solder mask from both sides.

Tom H Members Profile Send Private Message Find Members Posts Add to Buddy List Admin Group Joined: 05 Jan 2012 Location: San Diego, CA Status: Offline Points: 5716	Post Options Post Reply Quote Tom H Report Post Thanks(2) Quote Reply Posted: 11 Feb 2015 at 7:46pm
	Yes, I would highly recommend that you "Tent" the vias on the BGA side and leave the holes open on the bottom side. If you plug both sides, super heated gas in the hole could pop through the top or bottom solder mask but if you leave the bottom open it will let the heated gas during assembly reflow escape. If you want to cover both top and bottom holes I recommend that you fill the holes with something (over-plate, silver epoxy, solder mask) to eliminate the air in the hole. Super heated trapped air does things in assembly that damage the finished product. The last thing you need is popped air through solder mask under a BGA that you can't see.
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