2013.08 Released!!

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Version 2013.08 was just released!! 
NEW:
Added the Environment Level letter to the Footprint Name in the Print Feature
Pad stack names for IPC include thermal data (2013.08 - 2nd build)
 
FIXED:
FP Designer - Assembly outline size not changing
FP Designer - Mask and Stencil over/under size added to Through-hole
DIP, DIPS, SIP lead size not selecting the correct terminal goals
FP Designer Courtyard Crosshair checkbox not enabling
Pad stack Designer Proportional goals not setting correctly when ‘Lead Size’ is the source

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Nick B Members Profile Send Private Message Find Members Posts Add to Buddy List Admin Group Joined: 02 Jan 2012 Status: Offline Points: 1972	Post Options Post Reply Quote Nick B Report Post Thanks(0) Quote Reply Topic: 2013.08 Released!! Posted: 18 Jul 2013 at 9:01am
	Version 2013.08 was just released!! NEW: Added the Environment Level letter to the Footprint Name in the Print Feature Pad stack names for IPC include thermal data (2013.08 - 2nd build) FIXED: FP Designer - Assembly outline size not changing FP Designer - Mask and Stencil over/under size added to Through-hole DIP, DIPS, SIP lead size not selecting the correct terminal goals FP Designer Courtyard Crosshair checkbox not enabling Pad stack Designer Proportional goals not setting correctly when ‘Lead Size’ is the source
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Nick B Members Profile Send Private Message Find Members Posts Add to Buddy List Admin Group Joined: 02 Jan 2012 Status: Offline Points: 1972	Post Options Post Reply Quote Nick B Report Post Thanks(0) Quote Reply Posted: 23 Jul 2013 at 4:36pm
	A new 2013.08 build resolved these issues: Problem with application of gang mask on Convex chip arrays Problem with vertically oriented slots with round pads Window close 'X' appearing in reference picture Added 'Escape' key to bail on adding pins in FP Designer Added 'Delete' key to remove selected pins This update is available as of 7:30EST, July 23, 2013.
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