<?xml version="1.0" encoding="utf-8" ?>
<?xml-stylesheet type="text/xsl" href="RSS_xslt_style.asp" version="1.0" ?>
<rss version="2.0" xmlns:WebWizForums="https://syndication.webwiz.net/rss_namespace/">
 <channel>
  <title>PCB Libraries Forum : Land Patterns For Lead-Free Componet Soldering</title>
  <link>https://www.PCBLibraries.com/forum/</link>
  <description><![CDATA[This is an XML content feed of; PCB Libraries Forum : Footprints / Land Patterns : Land Patterns For Lead-Free Componet Soldering]]></description>
  <pubDate>Wed, 15 Apr 2026 22:45:03 +0000</pubDate>
  <lastBuildDate>Fri, 26 Oct 2012 07:04:22 +0000</lastBuildDate>
  <docs>http://blogs.law.harvard.edu/tech/rss</docs>
  <generator>Web Wiz Forums 12.07</generator>
  <ttl>360</ttl>
  <WebWizForums:feedURL>https://www.PCBLibraries.com/forum/RSS_post_feed.asp?TID=612</WebWizForums:feedURL>
  <image>
   <title><![CDATA[PCB Libraries Forum]]></title>
   <url>https://www.PCBLibraries.com/forum/forum_images/PCBLForumLogo.gif</url>
   <link>https://www.PCBLibraries.com/forum/</link>
  </image>
  <item>
   <title><![CDATA[Land Patterns For Lead-Free Componet Soldering :   All pad shapes are Lead-Free....]]></title>
   <link>https://www.PCBLibraries.com/forum/land-patterns-for-leadfree-componet-soldering_topic612_post2167.html#2167</link>
   <description>
    <![CDATA[<strong>Author:</strong> <a href="https://www.PCBLibraries.com/forum/member_profile.asp?PF=3">Tom H</a><br /><strong>Subject:</strong> 612<br /><strong>Posted:</strong> 26 Oct 2012 at 7:04am<br /><br />All pad shapes are Lead-Free. The pad shape has nothing to do with Lead-Free. <div>&nbsp; </div><div>The Rounded Rectangle Pad Shape is excellent for both Lead and Lead-Free solder. </div><div>&nbsp; </div><div>Solder Paster is applied over the entire pad with a Stencil that has aperture openings that where cut out using a laser. The laser does not create sharp corners but rather the corners of a rectangle pad shape are slighty rounded in the Paste Mask Stencil. </div><div>&nbsp; </div><div>When the PCB goes through the reflow oven, the paste mask melts and moves toward the component lead. The solder in the pad corners disappears. This happens on every surface mount pad for SOP, QFP, Molded Body, Chip, PLCC and other component families. </div><div>&nbsp; </div><div>Here is a top view picture of Chip Resistor on the top 2 pictures, Molded Body tantalum capacitors on the&nbsp;middle 2 pictures, SOP in the bottom 2 pictures&nbsp;and you can clearly see that after the reflow oven, there is no solder in the pad corners. The left side pictures&nbsp;are Lead solder and the right side is Lead Free Solder. </div><div>&nbsp; </div><div>&nbsp;<img src="uploads/3/Rounded_Rectangle_Solder_Pictures.png" height="430" width="377" border="0" /></div><div>&nbsp;&nbsp; </div>]]>
   </description>
   <pubDate>Fri, 26 Oct 2012 07:04:22 +0000</pubDate>
   <guid isPermaLink="true">https://www.PCBLibraries.com/forum/land-patterns-for-leadfree-componet-soldering_topic612_post2167.html#2167</guid>
  </item> 
  <item>
   <title><![CDATA[Land Patterns For Lead-Free Componet Soldering :  Solder paste size can be controlled...]]></title>
   <link>https://www.PCBLibraries.com/forum/land-patterns-for-leadfree-componet-soldering_topic612_post2166.html#2166</link>
   <description>
    <![CDATA[<strong>Author:</strong> <a href="https://www.PCBLibraries.com/forum/member_profile.asp?PF=1026">poojangarg</a><br /><strong>Subject:</strong> 612<br /><strong>Posted:</strong> 26 Oct 2012 at 4:06am<br /><br />Solder paste size can be controlled at both&nbsp;PCB design and manufacturing stage for that I don't think we need to modify complete pad structure.<div>&nbsp;</div><div>I am asking so much questions because in our organisation we have been facing soldering problem and we are suppose to resolve all the issues either it is at design stage or at manufacturing and we need to prepare a doument for that.</div><div>&nbsp;</div><div>So any further help in this thread or through document will be very grateful.</div><div>&nbsp;</div>]]>
   </description>
   <pubDate>Fri, 26 Oct 2012 04:06:49 +0000</pubDate>
   <guid isPermaLink="true">https://www.PCBLibraries.com/forum/land-patterns-for-leadfree-componet-soldering_topic612_post2166.html#2166</guid>
  </item> 
  <item>
   <title><![CDATA[Land Patterns For Lead-Free Componet Soldering : Ignoring solder paste aperture...]]></title>
   <link>https://www.PCBLibraries.com/forum/land-patterns-for-leadfree-componet-soldering_topic612_post2165.html#2165</link>
   <description>
    <![CDATA[<strong>Author:</strong> <a href="https://www.PCBLibraries.com/forum/member_profile.asp?PF=53">jameshead</a><br /><strong>Subject:</strong> 612<br /><strong>Posted:</strong> 26 Oct 2012 at 1:23am<br /><br />Ignoring solder paste aperture size and just looking at the copper pad alone I don't think that rounded rectangles are any better or worse then a normal rectangle for lead-free solder then leaded solder.<br><br>But because the viscosity of lead-free solder is different then the solder doesn't run out all the way to the corners of a rectangle pad so it's wasted copper that you may as well as eliminate by using a rounded corner.<br><br>The rounded corner has the advantage in that it gives you that little bit more space for routing tracks, at a 45 degree angle, next to the pad.<br><br>This is what I've picked up anyway by talking to a few people.&nbsp; I've not looked in depth at it.<br>]]>
   </description>
   <pubDate>Fri, 26 Oct 2012 01:23:40 +0000</pubDate>
   <guid isPermaLink="true">https://www.PCBLibraries.com/forum/land-patterns-for-leadfree-componet-soldering_topic612_post2165.html#2165</guid>
  </item> 
  <item>
   <title><![CDATA[Land Patterns For Lead-Free Componet Soldering : But how doesrouneded rectanglehelps...]]></title>
   <link>https://www.PCBLibraries.com/forum/land-patterns-for-leadfree-componet-soldering_topic612_post2164.html#2164</link>
   <description>
    <![CDATA[<strong>Author:</strong> <a href="https://www.PCBLibraries.com/forum/member_profile.asp?PF=1026">poojangarg</a><br /><strong>Subject:</strong> 612<br /><strong>Posted:</strong> 25 Oct 2012 at 9:51pm<br /><br />But how does&nbsp;rouneded rectangle&nbsp;helps in lead-free soldering so far whatever I had have read on internet is that it is manufacturing process that dictates lead-free soldering.]]>
   </description>
   <pubDate>Thu, 25 Oct 2012 21:51:28 +0000</pubDate>
   <guid isPermaLink="true">https://www.PCBLibraries.com/forum/land-patterns-for-leadfree-componet-soldering_topic612_post2164.html#2164</guid>
  </item> 
  <item>
   <title><![CDATA[Land Patterns For Lead-Free Componet Soldering :   Rounded Rectangular pad shape...]]></title>
   <link>https://www.PCBLibraries.com/forum/land-patterns-for-leadfree-componet-soldering_topic612_post2137.html#2137</link>
   <description>
    <![CDATA[<strong>Author:</strong> <a href="https://www.PCBLibraries.com/forum/member_profile.asp?PF=3">Tom H</a><br /><strong>Subject:</strong> 612<br /><strong>Posted:</strong> 25 Oct 2012 at 10:48am<br /><br />Rounded Rectangular pad shape will eventually take over as the only Pad Shape for SMT (BGA's are the exception). <div>&nbsp; </div><div>No more Rectangle, Oblong, D-Shape or&nbsp;Square, just Rounded Rectangle. It will take some time but eventually it will be the global universal standard.</div><div>&nbsp;</div>]]>
   </description>
   <pubDate>Thu, 25 Oct 2012 10:48:45 +0000</pubDate>
   <guid isPermaLink="true">https://www.PCBLibraries.com/forum/land-patterns-for-leadfree-componet-soldering_topic612_post2137.html#2137</guid>
  </item> 
  <item>
   <title><![CDATA[Land Patterns For Lead-Free Componet Soldering : the IPC7351-B is using rounded...]]></title>
   <link>https://www.PCBLibraries.com/forum/land-patterns-for-leadfree-componet-soldering_topic612_post2125.html#2125</link>
   <description>
    <![CDATA[<strong>Author:</strong> <a href="https://www.PCBLibraries.com/forum/member_profile.asp?PF=624">muthu</a><br /><strong>Subject:</strong> 612<br /><strong>Posted:</strong> 25 Oct 2012 at 5:34am<br /><br />the IPC7351-B is using rounded rectangle pad shape for many components, even the chip. Rounded pads are better for lead-free surface mount assembly using reflow, because lead-free solder doesn't flow as well as leaded solder and the aperture openings in the paste mask stencil are rounded corners. It may also benefit low profile components since it reduces the paste used.<br><img src="https://www.PCBLibraries.com/forum/smileys/smiley42.gif" border="0" alt="Handshake" title="Handshake" /><br>]]>
   </description>
   <pubDate>Thu, 25 Oct 2012 05:34:52 +0000</pubDate>
   <guid isPermaLink="true">https://www.PCBLibraries.com/forum/land-patterns-for-leadfree-componet-soldering_topic612_post2125.html#2125</guid>
  </item> 
  <item>
   <title><![CDATA[Land Patterns For Lead-Free Componet Soldering :  Hi All,   Is there any standard...]]></title>
   <link>https://www.PCBLibraries.com/forum/land-patterns-for-leadfree-componet-soldering_topic612_post2021.html#2021</link>
   <description>
    <![CDATA[<strong>Author:</strong> <a href="https://www.PCBLibraries.com/forum/member_profile.asp?PF=1026">poojangarg</a><br /><strong>Subject:</strong> 612<br /><strong>Posted:</strong> 15 Oct 2012 at 10:00pm<br /><br />Hi All, <div>&nbsp;</div><div>Is there any standard that we should follow for land patterns for Pb-Free componet soldering?</div><div>&nbsp;</div><div>Thanks</div><div>Poojan</div>]]>
   </description>
   <pubDate>Mon, 15 Oct 2012 22:00:29 +0000</pubDate>
   <guid isPermaLink="true">https://www.PCBLibraries.com/forum/land-patterns-for-leadfree-componet-soldering_topic612_post2021.html#2021</guid>
  </item> 
 </channel>
</rss>