PCB Libraries Forum : Additional Settings for Xpedition Padstack Export https://www.PCBLibraries.com/forum/ Sun, 12 Apr 2026 13:20:46 +0000 Thu, 31 Aug 2023 09:30:23 +0000 http://blogs.law.harvard.edu/tech/rss Web Wiz Forums 12.07 360 https://www.PCBLibraries.com/forum/RSS_post_feed.asp?TID=3312 <![CDATA[PCB Libraries Forum]]> https://www.PCBLibraries.com/forum/forum_images/PCBLForumLogo.gif https://www.PCBLibraries.com/forum/ <![CDATA[Additional Settings for Xpedition Padstack Export : Hello,how can I define additional...]]> https://www.PCBLibraries.com/forum/additional-settings-for-xpedition-padstack-export_topic3312_post13238.html#13238 Author: pildo
Subject: 3312
Posted: 31 Aug 2023 at 9:30am

Hello,

how can I define additional settings when generating outputs (Padstacks) for Siemens EDA - Xpedition?

Currently when generating Padstack.hkp files to be imported into EDM Librarian the names for PADs/HOLEs are very rudimentary and do not follow the Xpedtion naming scheme nor the IPC recommendation.

When generating an unencrypted ASCII export I've also noticed that the option "AUTO_GENERATED_NAME" is set for Holes which than isn't true.

Therefore now my question: How can I influence the definition of the pad/hole names and the additional settings as marked in the example?

Thanks.
Poldi

Example:
###################################
.FILETYPE PADSTACK_LIBRARY
.VERSION "02.00"
.CREATOR "PCB Libraries FPX Expert"
.DATE "Thursday, August 31, 2023 4:45:42 PM"

.UNITS MM

.PAD "Round 1.28mm"
 ..ROUND
  ...DIAMETER 1.28
 ..OFFSET (0, 0)

.PAD "Thermal 1.635mm"
 ..4_WEB_ROUND_THERMAL_45
  ...DIAMETER 1.635
  ...TIE_LEG_WIDTH 0.307
  ...THERMAL_CLEARANCE 0.1925
 ..OFFSET (0, 0)

.PAD "Round 1.635mm"
 ..ROUND
  ...DIAMETER 1.635
 ..OFFSET (0, 0)

.HOLE "Rnd 0.85"
 ..ROUND
  ...DIAMETER 0.85
 ..POSITIVE_TOLERANCE 0.08
 ..NEGATIVE_TOLERANCE 0.08
 ..HOLE_OPTIONS PLATED DRILLED AUTO_GENERATED_NAME
 ..DEPTH_ASSIGNMENT_METHOD THROUGH_HOLE
 ..DRILL_SYMBOL
  ...ASSIGN_DURING_OUTPUT
   ....SIZE 1.5

.PADSTACK "c128h85"
 ..PADSTACK_TYPE PIN_THROUGH
 ..TECHNOLOGY "(Default)"
  ...TECHNOLOGY_OPTIONS NONE
  ...TOP_PAD "Round 1.28mm"
  ...INTERNAL_PAD "Round 1.28mm"
  ...BOTTOM_PAD "Round 1.28mm"
  ...CLEARANCE_PAD "Round 1.635mm"
  ...THERMAL_PAD "Thermal 1.635mm"
  ...TOP_SOLDERMASK_PAD "Round 1.28mm"
  ...BOTTOM_SOLDERMASK_PAD "Round 1.28mm"
  ...HOLE_NAME "Rnd 0.85"
   ....OFFSET (0, 0)
###################################
]]> Thu, 31 Aug 2023 09:30:23 +0000 https://www.PCBLibraries.com/forum/additional-settings-for-xpedition-padstack-export_topic3312_post13238.html#13238