Standard Chip Component Dimensions

 

Here is the closest you will get to the Standard Case Sizes but good luck trying to find a manufacturer that uses these dimensions. Notice that the Height and Tolerances are missing because that is unique for every manufacturer. And the Height plays into the Toe solder joint calculation and the tolerances affect every aspect of the Land Pattern (footprint).

 

 

Download the document "Surface Mount Components" here - www.pcblibraries.com/downloads

 

It illustrates all the various types of SMD packages and the variety of Chip components.

 

 

 

 

Good luck with finding a single footprint to successfully accommodate every 0603 package. The Height is the main driver of this component lead form.

 

Issue: if you use a 0603 land pattern considering the highest package, you may be dumping too much solder on an 0603 that is 50% of that height, introducing potential tomb-stoning.

 

This new Proportional SMD technology will be available in the V2016 Library Expert.

 

 

I am a CIT trainer and teach hand soldering techniques to students.

 

The J-STD-001 has guidelines for minimum and maximum solder joint goal ranges. Every Terminal Lead form has it's specific percentages for pad size calculations. Example: Gull Wing lead is based on percentage of the pin pitch.

 

I'm just giving you a glimpse of the near future that you will not find in any publication today, will be in every standard next year.

 

 

For your 0603, it falls in the large component type and the same solder joint rules apply in both the IPC-7351B and IPC-7351C.

 

Here is the updated table for IPC-7351C and this is in V2015.15 of Library Expert Pro, Lite and Viewer for the smaller chip sizes.

 

As you can see, 0402, 0201 and 01005 have different Toe goals to prevent tomb-stoning.